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Wednesday 30 May 2018
Huaxintong to roll out 1st-generation server chip
Huaxintong Semiconductor Technology, a joint venture between China's Guizhou provincial government and Qualcomm, will reportedly roll out the first generation of its in-house developed...
Thursday 24 May 2018
Toshiba Memory to build new fab to expand 3D flash production capacity
Toshiba Memory (TMC) announced recently it had decided to start constructing a new fab for BiCS FLASH, the company's proprietary 3D flash memory, in Kitakami (Iwate prefecture, Japan)...
Tuesday 24 April 2018
StarVR debuts on Taiwan emerging stock market
StarVR, a VR device joint venture between Acer and Sweden-based Starbreeze, started trading on Taiwan's emerging stock market on April 23. On the first day of trading, StarVR's share...
Tuesday 17 April 2018
SPIL China subsidiary building new factory
IC packager Siliconware Precision Industries (SPIL) disclosed on April 16 that production subsidiary Siliconware Electronics (Fujian) has struck a deal with China MCC20 Group for...
Friday 13 April 2018
GCL-Poly to set up solar mono-Si wafer JV
The largest China-based solar poly-Si wafer maker GCL-Poly Energy Holdings has disclosed it will set up a factory making mono-Si ingots and wafers in Qujing, southwestern China, on...
Thursday 12 April 2018
Advantech sets up branch office in Vietnam
Industrial PC company Advantech has set up a branch office in Vietnam through a joint venture with system integrator partner TechPro.
Friday 30 March 2018
StarVR approved to list on Taiwan emerging stock market
StarVR, a VR device joint venture between Acer and Sweden-based Starbreeze, has obtained approval from the Taiwan Stock Exchange (TWSE) to list on the local Emerging Stock Board.
Wednesday 28 March 2018
Dow expands Asia CMP center
Dow Electronic Materials, a business unit of DowDuPont's specialty products division, held recently a ribbon-cutting ceremony for its phase-four expansion at its Asia CMP Manufacturing...
Friday 16 March 2018
ChipMOS Shanghai to target memory IC
ChipMOS Technologies (Shanghai) will target initially the memory chip market and make slow progress in expanding its target markets to include display driver ICs, according to SJ...
Friday 9 March 2018
Advantech readies new business strategy for worldwide IoT business units
Advantech has disclosed its strategies, plans and goals for 2018, indicating that in November it company will organize an Internet of Things (IoT) summit in Suzhou, China to demonstrate...
Thursday 8 March 2018
StarVR to roll out HMD VR devices with eye tracker
StarVR, a VR device joint venture between Acer and Sweden-based Starbreeze, plans to roll out a new head-mounted display (HMD) VR series with Tobii eye tracking capability in 2018...
Friday 2 March 2018
SMIC forms MEMS JV with China local government
Semiconductor Manufacturing International (SMIC), China's Shaoxing government and Shengyang Group have formed a joint venture named Semiconductor Manufacturing Electronics (Shaoxin...
Friday 9 February 2018
SPIL spends NT$710 million on equipment for China subsidiary
IC packager Siliconware Precision Industries (SPIL) has disclosed it has spent a total of NT$710.71 million (US$24.3 million) on equipment from Kulicke and Soffa Industries for its...
Tuesday 6 February 2018
Qualcomm, USI to form JV in Brazil
Qualcomm and Universal Scientific Industrial (Shanghai), a subsidiary of Advanced Semiconductor Engineering, have signed an agreement to form a joint venture in Sao Paulo. This joint...
Thursday 1 February 2018
SMIC obtains government fund for advanced node technology development
China-based pure-play foundry Semiconductor Manufacturing International (SMIC) has obtained financial support from the government to accelerate the development of its 14nm and more...