The emerging market for silicon carbide (SiC) and gallium nitride (GaN) power semiconductors is forecast to pass US$1 billion in 2021, energized by demand from hybrid & electric...

The primary yardstick by which the IC industry measures its technological performance and progress remains Moore's Law that states there is a doubling of the number of transistors...

SK Hynix has developed 16Gb DDR5 DRAM, which the company claims is the industry's first DDR5 to meet the JEDEC standards, according to the company.

Winbond Electronics has announced the introduction of the W25N01JW, a high-performance, 1.8V serial NAND flash memory IC delivering a new high in data-transfer rates: 83MB/s via a...

Cadence has disclosed a test chip containing next-generation DDR5 memory interface IP, which operates with Micron Technology's prototype DRAM chips. The test chip was fabricated in...

Toshiba Memory has enhanced its line-up of client SSDs with the launch of premium models in its XG5-P series. The new NVM Express (NVMe) client SSDs improve on the performance of...

Globalfoundries has demonstrated silicon functionality of a 2.5D packaging solution for its 14nm FinFET FX-14 integrated design system for application-specific integrated circuits...

EDA vendor Synopsys has introduced its complete DesignWare high bandwidth memory-2 (known as HBM2) IP solution consisting of controller, PHY and verification IP, enabling designers...

Macronix International has launched an AEC-Q100 Grade 2/3 compliant NAND flash memory product. The company added its NAND flash memory has passed all the stringent AEC-Q100 reliability...

JEDEC Solid State Technology Association has announced that its JC-45 committee has approved the first standards for support of "hybrid" DDR4 memory modules which are defined...

JEDEC Solid State Technology Association has announced the publication of JESD84-B51: Embedded MultiMediaCard (eMMC), Electrical Standard (5.1). eMMC v5.1 defines new features and...

Advanced packaging of semiconductor chips has emerged as a key enabler in many of today's electronic system products. While much attention with regard to IC packaging is on 3D stacking...

Memory industry standards body JEDEC Solid State Technology Association has announced the initial publication of Synchronous DDR4 standard. JEDEC DDR4 (JESD79-4) has been defined...

The JEDEC Solid State Technology Association has announced that its JC-64 Committee for embedded memory storage and removable memory cards has formed a subcommittee focused on the...

Memory industry standards body JEDEC Solid State Technology Association has announced the publication of JESD216 SFDP (serial flash discoverable parameter) for serial NOR flash. The...

Memory industry standards body JEDEC Solid State Technology Association has announced selected key attributes of its widely-anticipated DDR4 memory chip standard. With publication...

The JEDEC Solid State Technology Association has announced the publication of two standards for solid state drives (SSD): JESD218 SSD Requirements and Endurance Test Method, and JESD219...

Samsung Electronics and Numonyx have announced they are jointly developing market specifications for phase change memory (PCM) products, which feature faster read and write speeds...

Micron Technology has announced support of the newly-ratified JEDEC eMMC 4.4 standard with its portfolio of managed NAND solutions for mobile applications. Designed using Micron's...

JEDEC Solid State Technology Association has announced the publication of registered outline MO-297 for 1.8-inch slim solid state drives (SSDs) for a range of applications in consumer...

The JEDEC Solid State Technology Association has announced the publication of JESD84-A44 MMC Version 4.4 standard. The new standard offers designers numerous enhancements including...

Memory industry standards body JEDEC Solid State Technology Association has announced the publication of JESD209-2 LPDDR2 Low Power Memory Device Standard. The new standard offers...