On July 9, 2025, the JEDEC Solid State Technology Association, the leading organization for microelectronics standards, introduced LPDDR6 (JESD209-6), its latest low-power DRAM specification...

JEDEC has relaxed the height specification for sixth-generation high bandwidth memory (HBM4), clearing a key obstacle for South Korean memory leaders Samsung Electronics and SK Hynix...

The global push to meet surging demand from AI, high-performance computing (HPC), and advanced data centers has reached a new milestone. JEDEC, the international semiconductor standards...

The next generation of memory technology for High-Performance Computing (HPC) is on the horizon with the upcoming finalization of the HBM4 (High-Bandwidth Memory) specifications by...

The JEDEC Solid State Technology Association has announced that it is nearing completion of the next version of its highly anticipated High Bandwidth Memory (HBM) DRAM standard.

Memory industry standards body JEDEC Solid State Technology Association has announced the publication of the JESD239 GDDR7 SGRAM.

On May 21, 2023, the Cyberspace Administration of China (CAC) announced that products sold by Micron Technology in China did not pass cybersecurity review, and that according to Chinese...

SK Hynix has developed what the company claims to be the world's fastest mobile DRAM, LPDDR5 Turbo (LPDDR5T), with sample deliveries kicking off.

Etron Technology's in-house developed KOOLDRAM products are being adopted by car vendors, a milestone for its entry into the automotive sector, according to the Taiwan-based niche-market...

Micron Technology has unveiled memory and storage innovations across its portfolio based on its 176-layer NAND and 1α (1-alpha) DRAM technology, as well as what the company...

The emerging market for silicon carbide (SiC) and gallium nitride (GaN) power semiconductors is forecast to pass US$1 billion in 2021, energized by demand from hybrid & electric...

The primary yardstick by which the IC industry measures its technological performance and progress remains Moore's Law that states there is a doubling of the number of transistors...

SK Hynix has developed 16Gb DDR5 DRAM, which the company claims is the industry's first DDR5 to meet the JEDEC standards, according to the company.

Winbond Electronics has announced the introduction of the W25N01JW, a high-performance, 1.8V serial NAND flash memory IC delivering a new high in data-transfer rates: 83MB/s via a...

Cadence has disclosed a test chip containing next-generation DDR5 memory interface IP, which operates with Micron Technology's prototype DRAM chips. The test chip was fabricated in...