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Friday 17 September 2021
Asia Venturing III: Startups may add value to traditional industries by ESG innovations
Environmental, social, and governance (ESG) are becoming parts of important criteria to evaluate a company's value. ESG is crucial for a company not only because it brings positive...
Thursday 16 September 2021
Monolithic/heterogeneous integration to drive Silicon 4.0: Q&A with Etron chairman Nicky Lu
While global chip shortages can hardly ease in the short term and prices continue to rise further, regional semiconductor fleets are quietly taking shape as the US, EU, South Korea,...
Thursday 9 September 2021
Arm, Taiwan's ITRI join force to help IC design startups grow
Arm is partnering with Taiwan's Industrial Technology Research Institute (ITRI) to develop an ecosystem platform available for international IC design startups looking to invest in...
Friday 20 August 2021
Amkor: Empowering RF front end cellular innovations with DSMBGA
With the introduction of 5G, cellular frequency bands have increased considerably, requiring innovative solutions for the packaging of RF front-end modules for smartphones and other...
Tuesday 27 July 2021
Intel unveils technology roadmap to power products through 2025 and beyond
Intel has revealed the roadmap of its process and packaging innovations that will power the next wave of products through 2025 and beyond.
Friday 25 June 2021
Taiwan startups win 4 awards at VivaTech 2021
A team of 25 startups from Taiwan participated in the French government-supported VivaTech 2021 in Paris in mid June, with five of them winning four awards of the annual event, according...
Wednesday 2 June 2021
Micron intros 176-layer NAND, 1α DRAM technology
Micron Technology has unveiled memory and storage innovations across its portfolio based on its 176-layer NAND and 1α (1-alpha) DRAM technology, as well as what the company...
Wednesday 2 June 2021
TSMC unveils N6RF, N5A and new 3DFabric technologies
TSMC at its ongoing technology symposium held online has unveiled its latest innovations in advanced logic technology, specialty technologies, and the additions of its 3DFabric advanced...
Wednesday 31 March 2021
Over 65% of global GDP to come from digital products, services in 2022, says Dell Taiwan GM
The pandemic has been accelerating digital transformation at enterprises and industries worldwide with over 65% of global GDP estimated to come from digital products and services...
Tuesday 30 March 2021
IC equipment vendor KLA to boost local team in Taiwan
US-based semiconductor equipment vendor KLA is looking to beef up its operations in Taiwan with plans to hire an additional 100 staff this year.
Wednesday 24 March 2021
Acer Group eyes smart city business
The Acer Group via its four affiliates - AOpen, Acer Being Communication, Acer ITS and Altos Computing - is eyeing the business opportunities from smart city development particularly...
Wednesday 17 March 2021
Micron to shift resources from 3D XPoint to CXL memory
Micron Technology has announced updates to the company's portfolio strategy to further strengthen its focus on memory and storage innovations for the data center, with plans to cease...
Friday 26 February 2021
Kioxia breaks ground for new 3D NAND wafer fab
Kioxia held a groundbreaking ceremony for a semiconductor fabrication facility, dubbed Fab 7, at its factory site in Yokkaichi, Japan on February 24. The facility will be dedicated...
Friday 26 February 2021
Samsung begins mass production of datacenter SSD for hyperscale environments
Samsung Electronics has announced mass production of its most advanced line of datacenter SSDs - the PM9A3 E1.S - which fully complies with the Open Compute Project (OCP) NVMe Cloud...
Friday 19 February 2021
Kioxia, Western Digital announce 6th-gen 3D flash memory
Kioxia and Western Digital jointly announced they have developed their sixth-generation, 162-layer 3D flash memory technology.