Ilitek, a Taiwan-based DDI maker, said its first-quarter 2026 results were hit by seasonal softness and rising memory prices, which prompted Chinese smartphone brands to become more...
TPK Holding reported a sharp rebound in profitability for the first quarter of 2026, driven by new semiconductor investments and favorable one-off gains.
DDI supplier Ilitek held an earnings call on November 12, 2025, attributing its third-quarter revenue growth to the completion of platform transitions by key customers and the start...
Touch panel maker TPK Holding announced plans to acquire a 23.83% stake in IC design firm Ilitek for NT$5.807 billion (approx. US$188 million), at NT$49.5 per share, making TPK the...
Display driver IC (DDI) specialist Ilitek is poised to re-enter the capital market in late November as ITH Corporation. Ahead of ITH's upcoming listing on the stock market, chairman...
Display driver IC backend specialists including Chipbond Technology and ChipMOS Technologies have enjoyed a ramp-up in orders for handset-use TDDI chips, with clear order visibility...
MediaTek expects to post revenues of between NT$89.5 billion (US$3.13 billion) and NT$97.3 billion in the fourth quarter of 2020, representing flat growth or an up to 8% decrease s...
Most Taiwan-based LCD driver IC suppliers have seen their order visibility improve as handset brands gear up for the launch of new models in the third quarter, and PC and notebook...
Display driver IC backend specialists including ChipMos Technologies and Chipbond Technolofy are expected to enjoy a significant ramp-up in demand for handset applications, including...
LCD driver IC specialist Novatek Microelectronics expects orders to pick up starting the latter part of the third quarter, thanks to the launch of diverse ranges of new smartphones...
Taiwan-based display driver IC designers and backend specialists are looking to ready additional capacities by mid-2020 to meet growing demand for OLED driver ICs, according to industry...
Backend demand for OLED driver ICs is set to take off in 2020, with COP (chip on plastic) and COF (chip on film) likely to co-exist as main packaging processes, according to industry...
