Buoyed by rising demand for PCBs used in consumer electronics products, and CPU-use flip-chip (FC) substrates, Nanya PCB (NPC) saw October 2010 revenues increase 6.04% sequentially...
IC substrate makers Nanya Printed Circuit Board (NPC) and Kinsus Interconnect Technology both saw revenues decrease sequentially in September 2010, according to data released by the...
Nanya PCB (NPC) and Unimicron Technology have expressed caution about their business outlook for the fourth quarter of 2010, due to a continued slowdown in demand from the PC secto...
Taiwan-based IC substrate maker Kinsus Interconnect Technology revealed that construction of a new plant in Suzhou, China is near completion, and production will kick off in the fourth...
IC substrate maker Kinsus Interconnect Technology expects its revenues to grow 5-10% sequentially in the third quarter with flip-chip chip-scale packaging (FC CSP) and base station...
IC substrate makers Kinsus Interconnect Technology and Nan Ya Printed Circuit Board (NPC) have posted strong revenues for June 2010, with Kinsus's monthly figures hitting a record...
IC substrate makers Nanya Printed Circuit Board (NPC) and Kinsus Interconnect Technology both saw their revenues increase in a range of 37-38% on year in May due to strong demand...
IC substrate maker Kinsus Interconnect Technology has revised upward its revenue guidance for the second quarter of 2010 to a 20-25% sequential growth from the 10-15% projected earlier,...
Nanya PCB has revealed plans to boost its flip-chip (FC) substrate capacity by 5-7 million units for a total of 35-37 million units a month by the end of June 2010, and also expand...
Unimicron Technology plans to ramp up its capacity for flip-chip (FC) substrates by 15-18% in the third quarter to meet increasing demand, company spokesman Shen Tsai-sheng said at...
IC substrate makers Nanya Printed Circuit Board (Nanya PCB) and Kinsus Interconnect Technology are expected to see their revenues grow 5-10% and 10-15%, respectively, in the second...
The supply of IC substrates is expected to become tight, or even fall short of demand, in the second half of 2010 due to strong market demand for handset and graphics card chips,...
Kinsus Interconnect Technology has seen its order visibility extend to May 2010, with new orders focusing on bismaleimide triazine (BT)-based flip-chip chip scale packaging (FC CSP)...
IC substrate maker Kinsus Interconnect Technology expects its capex for 2010 to reach NT$1.5 billion (US$46.8 million), up from NT$800 million in 2009. The company also revealed that...
Shares of Taiwan-based IC substrate maker Kinsus Interconnect Technology fell the 7% daily limit to close at NT$80 (US$2.49) on the Taiwan Stock Exchange (TSE) on January 28 after...
