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Friday 29 November 2024
China's semiconductor industry makes significant strides, putting pressure on South Korean firms
China's largest foundry operator, SMIC, surpassed the US$2 billion revenue mark for the first time in the third quarter of 2024. Meanwhile, companies like CXMT and JHICC are aggressively...
Friday 29 November 2024
Micron targets Samsung's home turf with 'on-the-spot hiring' to attract talent
Micron has intensified its recruitment efforts in South Korea, targeting university campuses with "on-the-spot hiring" initiatives. Previously focused on hiring experienced engineers...
Thursday 28 November 2024
Lam Research to set up office at Tata-PSMC wafer fab
Taiwan-based pure-play foundry PSMC is building a 12-inch wafer fab for Tata Electronics in India, and Lam Research, eyeing growing Indian opportunities, plans to set up an office...
Thursday 28 November 2024
TSMC donates more 12-inch fab equipment to Taiwan govt
Following a previous donation of two sets of 12-inch wafer equipment to Taiwan's National Science and Technology Council (NSTC), TSMC has donated an additional three sets to the Ministry...
Thursday 28 November 2024
IDMs develop automotive chips tailored for China market
International integrated device manufacturers (IDMs) have begun offering automotive-grade chips specifically designed for the China market in 2024, responding to mounting cost pressures...
Thursday 28 November 2024
Taiwan-made DUV photoresist likely to complete terminal production line verification by end of 2024
Although the US and Dutch governments have banned ASML from selling extreme ultraviolet (EUV) and advanced deep ultraviolet (DUV) lithography equipment to China, sales and after-sales...
Thursday 28 November 2024
Funding cuts, layoffs, and reorganization common in China's competitive chip industry
In 2024, major Chinese semiconductor businesses continue to announce closures or severe layoffs, according to industry sources. Xiangdixian Computing Technology, commonly referred...
Thursday 28 November 2024
Equipment supplier gives hints at FOPLP development progress among Taiwanese companies
Fan-out panel level packaging (FOPLP) is a promising semiconductor technology that has been attracting investments from Taiwan's supply chains, including IC foundries, OSATs, panel...
Wednesday 27 November 2024
TSMC's CoWoS far from secure: Etron CEO flags Intel EMIB's rising threat
TSMC's CoWoS technology continues to scale, driven by strong demand from major clients such as Nvidia. Production capacity is projected to reach 75,000 units by 2025, with the persistent...
Wednesday 27 November 2024
Samsung executive reshuffle: new foundry head to boost Nvidia ties
Samsung Electronics (Samsung) has implemented a significant personnel adjustment within its Device Solutions (DS) division to regain competitiveness in the semiconductor sector. This...
Wednesday 27 November 2024
Samsung hires new foundry CTO amidst leadership changes
Samsung Electronics has enacted changes to its management, including the appointment of a new chief technology officer (CTO) for its foundry operations.