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Friday 22 August 2025
TSMC's gross margin nears 60% as equipment allies shine
TSMC's strong second-quarter results demonstrated resilience amid global challenges, posting a 58.6% gross margin and NT$759.83 billion (US$24.93 billion) revenue in the first half...
Friday 22 August 2025
TSMC keeps Japan in focus with 2nd Kumamoto fab set to break ground in 2025
TSMC board member Paul Liu confirmed the chipmaker will break ground on a second fab in Kikuyo, Kumamoto Prefecture, in 2025 as scheduled, rejecting speculation that Japan's role...
Friday 22 August 2025
Google switches to TSMC for Tensor G5 as Pixel 10 series launches

Google has officially launched its latest lineup of Pixel devices, all powered by the next-generation Tensor G5 chip, built using TSMC's...

Friday 22 August 2025
Nvidia reportedly orders halts H20 chip production amid China market backlash
Nvidia's H20 AI chip, once expected to anchor its sales in China, now faces an uncertain future as reports surface of halted production orders amid Beijing's push for local alternatives...
Friday 22 August 2025
Equity-for-subsidies: Samsung and Seoul fear US govt overreach
The Trump administration is exploring acquiring equity stakes in major semiconductor companies, including Samsung Electronics, following its interest in Intel Corporation. This move,...
Friday 22 August 2025
TSMC considers returning subsidies as US official clarifies no equity stake planned, according to WSJ
The US government has no plans to take equity stakes in major semiconductor companies like TSMC and Micron, despite speculation fueled by recent comments on potential investments...
Friday 22 August 2025
Nvidia CEO's third Taiwan trip in 2025: talk H20, US govt stake and visits TSMC
Nvidia CEO Jensen Huang made an unannounced visit to TSMC on August 22, arriving at Taipei airport early in the morning by private jet. Huang stated that the purpose of this trip...
Friday 22 August 2025
Nvidia to adopt CoWoP advanced packaging for 2027 AI GPU, reshaping PCB supply chain
Nvidia Corporation is set to implement a new advanced packaging technology called Chip-on-Wafer-on-Platform PCB (CoWoP) for its next-generation GR150 AI GPU, expected to launch in...
Friday 22 August 2025
Samsung boosts 2nm chip competitiveness with Hyper Cell tech
Samsung Electronics' foundry business plans to leverage its Hyper Cell technology to maintain its competitiveness in the 2nm semiconductor process. By adopting a more flexible chip...
Friday 22 August 2025
ITC ruling against BOE opens door for South Korea, Taiwan's Novatek under pressure
The US International Trade Commission (ITC) has issued a preliminary ruling against China's BOE, banning its OLED panels from the US market for nearly 15 years. The decision opens...
Friday 22 August 2025
Urban mining pioneer Lianyou Metals leads in tungsten and cobalt recycling , eyes stronger 2H25
Amid rising geopolitical risks and tightening global supply chains, the strategic value of rare metals has come into sharp focus. Taiwan's Lianyou Metals, leveraging patented smelting...
Thursday 21 August 2025
Taiwan pledges lifeline to SMEs as US tariffs bite
Taiwan's Minister of Economic Affairs Jyh-huei Kuo met with representatives from Taiwanese small and medium-sized enterprises (SME) on August 18 to discuss the impact of US reciprocal...
Thursday 21 August 2025
Taiwan's MPI grabs first-mover advantage in MEMS probe cards for AI chips

Taiwan's MPI Corporation is set to benefit from a major shift in semiconductor testing, as global cloud providers ramp up custom AI chip...

Thursday 21 August 2025
Pixel 10 powered by Tensor G5 on TSMC 3nm with 34% CPU gain and 60% faster AI
Alphabet Inc. has introduced its latest Pixel 10 series smartphones featuring the newly developed Tensor G5 processor, marking the company's most significant upgrade in custom chip...
Thursday 21 August 2025
Samsung's Lee Jae-yong hints at 2026 chip comeback after US visit
Samsung Electronics Executive Chairman Lee Jae-yong returned to South Korea this week after more than two weeks in the US, telling reporters at the airport he was "ready for 2026."...