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Wednesday 10 September 2025
SEMICON Taiwan 2025: Alliance Material showcases breakthrough double-sided RDL glass substrate process
Alliance Material, a semiconductor materials company, reported a surge in revenue in August 2025, reaching NT$67.93 million (US$2.23 million), a 15.84% increase from July and nearly...
Wednesday 10 September 2025
Exclusive: TSMC turns legacy fabs into EUV pellicle powerhouse, signals new front in chipmaking
TSMC has confirmed it will exit gallium nitride (GaN) foundry operations within two years, shutting down production at its 6-inch Fab 2 in Hsinchu Science Park. The company is also...
Wednesday 10 September 2025
Highlights from China International Optoelectronic Expo and SEMI-e: sovereign AI, drones, AR/VR/MR in focus
The 26th China International Optoelectronic Expo (CIOE) and the Shenzhen International Semiconductor & IC Exhibition (SEMI-e 2025) are being held at the Shenzhen International...
Wednesday 10 September 2025
SEMICON Taiwan 2025: Zeiss hits milestone of 10 High NA optic systems shipped as TSMC probes future of Hyper NA EUV
At SEMICON Taiwan 2025, Zeiss Semiconductor Manufacturing Technology offered a rare glimpse into the future of extreme ultraviolet (EUV) lithography, outlining its optics roadmap...
Wednesday 10 September 2025
China's NSIG to absorb loss-making wafer subsidiaries in US$967M restructuring
China's top silicon wafer maker, National Silicon Industry Group (NSIG), has unveiled a major restructuring, taking full control of three loss-making 12-inch wafer subsidiaries. The...
Wednesday 10 September 2025
AI chip demand drives future semiconductor growth trends
SEMICON Taiwan 2025 opened on September 10, with numerous forums already underway ahead of the event. Various research institutions have expressed cautiously optimistic views on the...
Wednesday 10 September 2025
FOPLP progress is fastest in foundries, slower in testing and panel fabs
Foundries lead in FOPLP advanced packaging development due to their integrated processes, followed by testing firms that leverage existing wafer architectures. Panel fabs face precision...
Wednesday 10 September 2025
AI infrastructure investment may enter adjustment phase in 2026, with small-and medium-sized business demand driving new momentum
At the SEMICON Taiwan event held in September, key international figures from the semiconductor, robotics, and future vehicle sectors convened, highlighting Taiwan's rising importance...
Wednesday 10 September 2025
Taiwan pushes immersion cooling, CoWoS tech into US AI server supply chain
Taiwan's Ministry of Economic Affairs has approved a NT$250 million (US$8.2 million) project spearheaded by Aewin Technologies, Kenmec Mechanical Engineering, and I-Chiun Precision...
Tuesday 9 September 2025
TSMC and ASE form 3D IC alliance with 34 members to overcome advanced packaging bottlenecks
To break through the technical, mass production, and yield challenges in advanced packaging processes such as 3D IC and CoWoS, SEMI, together with TSMC and ASE Holdings, has established...
Tuesday 9 September 2025
Five years on, Taiwan's G2C positions local equipment makers at center of AI packaging shift
Soaring demand for AI computing is ushering the semiconductor sector into a fresh cycle of high-speed growth, pushing advanced packaging requirements to new heights. From infrastructure...
Tuesday 9 September 2025
Kemflo International expands into activated carbon regeneration for semiconductor industry
Kemflo International has completed its activated carbon regeneration plant in Pingtung and is moving forward with environmental certification and licensing as it shifts focus toward...
Tuesday 9 September 2025
RongSemi denies fab halt as YMTC Veteran takes key role in Ningbo expansion
Simon Yang, the former YMTC CEO and later deputy chairman, has joined Rong Semiconductor (Ningbo) Co. (RongSemi) as head of its technical expert committee. The announcement came alongside...
Tuesday 9 September 2025
HBM race intensifies: Micron’s yield confidence fuels supply chain bets
The high bandwidth memory (HBM) market has become one of the most competitive arenas in the semiconductor industry, with Micron Technology signaling its confidence in its position...
Tuesday 9 September 2025
L&T Semiconductor Technologies acquires Fujitsu General Electronics' power module design assets
India-based IC design firm L&T Semiconductor Technologies (LTSCT) announced on Friday that it has acquired the power module design assets of Japan's Fujitsu General Electronics...