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Tuesday 2 September 2025
FOPLP mass production: Innolux’s breakthrough or trial run?
Innolux regards fan-out panel-level packaging (FOPLP) as a major strategic transformation, but its mass production schedule has been repeatedly delayed. During this process, high-level...
Tuesday 2 September 2025
Korean media highlight Taiwan’s hard line in TSMC leak
Taiwan's prosecutors are pursuing a 14-year prison term in a high-profile TSMC trade secrets case, underscoring how Taipei views semiconductor technology leaks as threats to national...
Tuesday 2 September 2025
Hanwha Semitech advances fluxless bonding to address HBM packaging strains
As high-bandwidth memory (HBM) moves to taller stacks with denser chip-to-chip I/O connections, thermal compression bonding (TC bonder) technology is hitting bottlenecks. Hanwha Semitech...
Tuesday 2 September 2025
South Korea's Nextin lands SK Hynix deal, plans expansion in Japan, US, and Europe
South Korea-based optical wafer inspection equipment manufacturer Nextin has made strides in the high-bandwidth memory (HBM) segment, gaining traction after launching its dedicated...
Monday 1 September 2025
Column: Modern computational methods transform semiconductor manufacturing landscape
Since 2000, semiconductor manufacturing has increasingly depended on advanced computational techniques, notably first principles calculations and machine learning, with quantum computing...
Monday 1 September 2025
TPCA Show to kick off in October with Unimicron chair as keynote speaker
The technology supply chain will gather for a series of exhibitions in the second half of 2025, including Taiwan's major PCB industry event, the TPCA Show, which will take place from...
Monday 1 September 2025
Rapidus 2nm chip matches TSMC's logic density, outpaces Intel in performance

Rapidus is preparing to launch its most advanced chip yet, a 2nm process called "2HP," that could put it nearly on par with TSMC's N2...

Monday 1 September 2025
Samsung and SK Hynix waiver revoked: Korean chipmakers hobbled, China memory benefits
The Trump administration has revoked long-standing exemptions that allowed Samsung Electronics and SK Hynix to use US equipment freely at their chip plants in China, a move that has...
Monday 1 September 2025
SMIC tightens grip on Beijing unit in latest wave of China wafer fab mergers
China's SMIC said it will acquire the remaining 49% stake in its subsidiary, SMIC North Integrated Circuit Manufacturing (Beijing), also known as SMIC North, through an issuance of...
Monday 1 September 2025
Intel receives US$5.7B government investment; shareholding deal still under negotiation
Intel CFO David Zinsner recently revealed that the company has received a US$5.7 billion subsidy from the US government under the CHIPS and Science Act. This funding is part of an...
Monday 1 September 2025
Amkor revises site plan for Arizona advanced packaging facility
Amkor Technology, Inc. announced on August 28 that it will relocate the planned site of its new advanced semiconductor packaging and test facility in Arizona to the Peoria Innovation...
Monday 1 September 2025
Weekly news roundup: Intel revives AI chip fight with Jaguar Shores; Samsung may invest in Intel packaging push
Below are the top DIGITIMES Asia stories from August 25 to 31, 2025.
Monday 1 September 2025
TSMC to raise foundry prices by 5-10% across advanced nodes in 2026
TSMC plans to increase foundry prices for its advanced semiconductor processes by approximately 5% to 10% in 2026, according to sources in the IC design industry.
Monday 1 September 2025
Samsung steps up hiring in US as Tesla and Apple orders drive expansion
Samsung Electronics is stepping up hiring for its US semiconductor operations, posting a wave of openings for engineers and process specialists in Austin and Taylor, Texas. The roles,...
Monday 1 September 2025
India roundup: Modi turns US 50% tariff blow into reform push
The US's 50% tariff on India took effect on August 27, dealing a blow to Indian exporters. India's semiconductor push is gaining traction.