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NEWS TAGGED HBM
Thursday 8 May 2025
AP Memory bets on next-gen wearables and AI chips to drive 2025 growth

AP Memory, a leading Taiwanese designer of specialty memory ICs and intellectual property (IP), said it remains optimistic about growth...

Thursday 8 May 2025
SK Hynix to end DDR4 production by 2Q26, sparks supply crunch
The two major South Korean DRAM manufacturers are each preparing to discontinue their older DDR4 production lines. Following Samsung Electronics' early April announcement of its end-of-life...
Tuesday 6 May 2025
SK Hynix-Hanmi Semiconductor dispute escalates, Hanwha Semitech poised to gain
A brewing conflict between SK Hynix and its long-time supplier, Hanmi Semiconductor, over thermal compression bonder (TC Bonder; TCB) equipment has intensified, potentially reshuffling...
Friday 2 May 2025
Samsung chip earnings nosedive 62%: HBM edge ceded to SK Hynix?
Samsung Electronics beat expectations in the first quarter of 2025, posting revenue of KRW79.1 trillion (US$55 billion) and operating profit of KRW6.7 trillion. However, its Device...
Wednesday 30 April 2025
Samsung reportedly exits HBM2E under Chinese price offensive, shifts focus to high-end market
Samsung Electronics is cutting production of mature-node DDR4 memory and reportedly scaling back its third-generation high-bandwidth memory (HBM2E) business to focus resources on...
Wednesday 30 April 2025
Made in America, delayed by parts
Taiwan's electronics manufacturing services (EMS) providers are accelerating their North American production plans in response to tariff threats, but component shortages and capacity...
Tuesday 29 April 2025
Samsung shifts focus to 3D DRAM in intensifying competition from SK Hynix and Chinese rivals
Samsung Electronics has reportedly decided to adopt Vertical Channel Transistor (VCT) DRAM as its core next-generation memory product, with plans to begin mass production within the...
Friday 25 April 2025
Exclusive: Google considers HBM3E supplier change
Samsung Electronics has recently intensified its deployment in advanced high bandwidth memory (HBM) processes. However, supply chain sources reveal that Samsung's HBM3E certification...
Friday 25 April 2025
JEDEC bends rules—Samsung, SK Hynix charge ahead in AI memory war
JEDEC has relaxed the height specification for sixth-generation high bandwidth memory (HBM4), clearing a key obstacle for South Korean memory leaders Samsung Electronics and SK Hynix...
Wednesday 23 April 2025
Hanmi reshapes South Korea's HBM arena, eyes Samsung alliance as SK Hynix ties fray
The South Korean semiconductor industry is abuzz with intrigue as Hanmi Semiconductor's once-ironclad relationship with SK Hynix frays over the supply of thermal compression bonders...
Tuesday 22 April 2025
Hanmi Semiconductor's tough stance against SK Hynix supported by large TC bonder order from Micron
South Korean media outlets have reported that Hanmi Semiconductor has received additional orders for thermo-compression bonding (TCB) equipment from Micron Technology. Some industry...
Monday 21 April 2025
Samsung lifts HBM yield as US tariffs loom over China-made chips
South Korean media have reported that Samsung Electronics has made notable progress in developing next-generation high-bandwidth memory (HBM). According to Chosun Biz, the...
Monday 21 April 2025
China's CXMT muscles into DRAM's top tier—Is 'Big Three' era over?
Forecasts suggest ChangXin Memory Technologies (CXMT), China's leading DRAM supplier, will dramatically expand its output in 2025—far surpassing previous expectations. If current...
Saturday 19 April 2025
Huawei's AI ambitions face energy efficiency test

Huawei's CloudMatrix 384 (CM384) is making waves as the most ambitious AI hardware rollout in China to date—a rack-scale system powered...

Friday 18 April 2025
Micron challenges South Korean dominance in HBM market amid tariff protectionism
Recently, reports from South Korea claim that Micron is set to become a rising star in the HBM market, following Samsung Electronics and SK Hynix. Although Donald Trump's current...