Friday 4 August 2023
ProLogium to receive EUR1.5 billion subsidy
The European Commission has approved a sizeable grant to support ProLogium's gigafactory project in France, according to the solid-state battery specialist.
Tuesday 1 August 2023
AMD plans US$400 million over 5 years to expand R&D and engineering operations in India
AMD has announced plans to invest approximately US$400 million in India over the next five years. The planned investment consists of a new AMD campus in Bangalore, Karnataka that...
Tuesday 20 June 2023
Intel to scale up investment in planned German site
Intel and the German federal government have signed a revised letter of intent for Intel's planned leading-edge wafer fabrication site in Magdeburg, the capital of Saxony-Anhalt....
Monday 8 May 2023
China reportedly pours CNY12.1 billion into local chipmaking sector
In 2022, the Chinese government allocated CNY12.1 billion (US$1.75 billion) in subsidies to 190 listed semiconductor companies to fill the gap left by US restrictions on advanced...
Tuesday 12 July 2022
ST, GF team up for 300mm wafer fab in France
STMicroelectronics and GlobalFoundries have signed a MoU to build a 300mm semiconductor manufacturing facility in France, according to the chipmakers.
Wednesday 30 March 2022
TSMC Arizona fab unlikely to earn without government subsidies
It may be hard for TSMC to generate profits from its new advanced wafer fab in Arizona when the facility becomes operational, if the US government fails to carry out its commitment...
Tuesday 19 March 2019
SEMICON China 2019 to open March 20
SEMICON China 2019 will open March 20 for a three-day run at Shanghai New International Expo Center, with global semiconductor industrial chains to showcase their latest technologies,...
Wednesday 29 March 2017
Tsinghua Unigroup to obtain more funds from government
Tsinghua Unigroup on March 28 announced it had signed a deal with the China Development Bank (CDB), under which the bank will provide Tsinghua Unigroup with CNY100 billion (US$14.5...
Thursday 16 March 2017
China IC design industry growing
The "Made in China 2025" (MIC 2025) plan, published by the China State Council in May of 2015, has demonstrated the country's ambition to enhance its fabless IC design industry...
Tuesday 14 March 2017
China 12-inch fab capacity set to boom
With major China-based chipmakers set to build new 12-inch fabs, the overall 12-inch fab capacity in China is expected to peak over the next two to three years.
Thursday 2 February 2017
China MIC 2025 results for ICs likely to fall short of its goals, says IC Insights
China's government has a long-term goal to become self-sufficient with regards to IC devices. Its "Made in China 2025" (MIC 2025) plan was published by the China State Council...
Tuesday 13 December 2016
Commentary: Silicon wafer industry headed for consolidation
With Siltronic reportedly drawing interest from China's state-backed industry group, the global silicon wafer industry is expected to go through a period of consolidation in 2017.
Monday 14 November 2016
Three major China firms gearing up to enter DRAM market
Yangtze River Storage Technology (YRST), Fujian Jin Hua Integrated Circuit, and a joint venture set up by GigaDevice Semiconductor and the Hefei city government of China's Anhui province,...
Friday 4 November 2016
Lattice Semiconductor to be acquired for US$1.3 billion
Lattice Semiconductor and Canyon Bridge Capital Partners, an affiliate of Canyon Bridge, have signed a definitive agreement under which Canyon Bridge Capital Partners will acquire...
Wednesday 26 October 2016
Alchip to set up subsidiary in Hefei
Alchip Technologies, a Taiwan-based provider of ASIC/SoC design services, has signed an MoU with the Hefei city government of China's Anhui province to set up a subsidiary locally.