AMD and Xilinx have announced they have entered into a definitive agreement for the former to acquire the latter in an all-stock transaction valued at US$35 billion.
Taiwan-based Unimicron, Nan Ya PCB and Kinsus Interconnect Technology have seen their ABF substrate capacities fully booked throughout the first half of 2021 thanks to strong demand...
At the inaugural Architecture Day held in late 2018, a new technical group headed by Intel senior vice president and chief architect Raja Koduri first came up with six strategic pillars...
Taiwan-based IC substrate makers including Unimicron Technology and Na Ya PCB are gearing up to strengthen business ties with US clients seeking to offset expected losses of orders...
Kinsus Interconnect Technology will strive to grow its business in the FCBGA and AiP packaging fields this year seeking to better cash in on new business opportunities arising from...
Taiwan Semiconductor Manufacturing Company (TSMC) expects significant sales from the the high performance computing (HPC) sector in 2020, an indication that chip vendors are still...
Taiwan's IC testing and certification service labs have seen orders from the non-Apple camp ramp up drastically for inspecting and analyzing HPC chips demanding advanced-node manufacturing,...
Unimicron Technology has seen clear order visibility for high-end IC substrates, especially ABF substrates for processing diverse HPC and networking chips, stretching to the third...
Robust demand for ABF substrates has significantly driven up first-quarter 2020 revenues at Nan Ya PCB and Kinsus Interconnect, with the growth momentum expected to last through at...
Taiwan-based IC distributors are seeing stable demand for chips used in cloud/edge computing, large datacenters, 5G base stations and servers, as consumers turn to services or entertainments...
Taiwan-based Answer Technology (ANStek), which distributes mainly ICs for niche-market applications, has reported net profits grew 2.5% to NT$182 million (US$6.02 million) in 2019...
Taiwan's IC distributors have posted mixed revenues for February, with those distributing 5G base station, server and memory chips as well as niche applications performing better...
TSMC is set to kick off volume production of chips built using 5nm process technology in April, and has already seen the process capacity fully booked by clients, according to industry...
The global market for memory and processing semiconductors used in artificial intelligence (AI) applications will soar to US$128.9 billion in 2025, three times the US$42.8 billion...
US FPGA chips specialist Xilinx will step up development of self-adaptive AI chips for automotive applications based on the emerging concepts of Mobility as a Service (MaaS) and Transportation...