中文網
繁體
简体
SUBSCRIBE
TECH
Tech Home
Semiconductors
Communications
ICT
Displays
Electric Vehicles
Sustainability
REGIONS
Asia Home
East Asia
Southeast Asia
South Asia
Middle East
AsiaTech Frontier
RESEARCH
OPINIONS
Opinions Home
Interviews
Commentary
Research Insights
Column
FINANCE
BIZ FOCUS
Biz Focus Home
Trending Issues
COMPUTEX
SEMICON
CES
EVENT+
Event+ home
Featured Events
MULTIMEDIA
SUBSCRIBE
Trending
Apple
Nvidia
TSMC
AI Search
NTN Convergence
Robotics Report
Advanced Packaging
Trending
SUBSCRIBE
CONNECT WITH US
REALTIME NEWS
Blaize and Nokia expand partnership to validate hybrid AI infrastructure across Asia-Pacific
ICT
10min ago
MediaTek builds an end-to-end challenge to Qualcomm and Broadcom
Semiconductors
26min ago
CoWoS capacity emerges as AI bottleneck as TSMC’s advanced packaging grows at 80% CAGR
Semiconductors
37min ago
Advanced packaging emerges as new battleground in AI chip race between Taiwan and US
Tomorrow's Headlines
Apr 9, 18:45
AD Technology targets KRW 1 trillion revenue with 2nm CPU platform by 2029-2030
Tomorrow's Headlines
Apr 9, 18:45
South Korean panel profits expected to rise despite chipflation
Tomorrow's Headlines
Apr 9, 18:45
NEWS TAGGED FINETECH JAPAN 2010
Monday 19 April 2010
Finetech Japan 2010: Exhibitors showcase latest 3D, e-paper technologies
Color e-paper and 3D glasses-free display products were a major attraction at the just concluded Finetech Japan 2010 in Tokyo.
Thursday 15 April 2010
Finetech Japan 2010: LED and OLED lighting a major theme
Finetech Japan 2010 kicked off on April 14 in Tokyo, with a strong presence of LED, OLED and other energy-saving lighting products.
BIZ FOCUS
Feb 9, 08:00
iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
Friday 6 February 2026
2026 Market Outlook: Key Opportunities & Risks to Watch
Thursday 5 February 2026
Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
Wednesday 4 February 2026
Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
MOST-READ
7 DAYS NEWS
TSMC plans 12 fabs in Arizona as supply chain shifts from passive to active
HBM4 showdown at GTC 2026: SK Hynix, Samsung, and Micron battle for AI memory supremacy
AI compression won't ease memory crunch, NAND shortage set to persist
DRAM prices surge 180% as HBM competition shifts to profitability
TSMC eyes SiPh breakthrough as industry consensus forms
Samsung and SK Hynix reportedly secure long-term helium contracts with US firms
CXMT targets 12-layer HBM production by 2027, closing gap with Korea
TCL-Sony merger shifts the competitive landscape for Korean TV giants
Alibaba's Qwen tops Korea's AI benchmark
San'an Optoelectronics executives under further investigation amid family control concerns
Full list
RESEARCH INSIGHTS
Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook
Members only
×
Sorry, the page you are trying to open is available only for our paid subscribers.
Please
login
to read more
New users, please
register
first