Intel officially announced on October 9 (Taipei time) the beginning of mass production at Fab 52, its latest wafer plant. The new fab, located in Chandler, Arizona, marks a significant...
The annual SEMICON West relocated for the first time to Phoenix in 2025, the new hub of US chip manufacturing. Compared to previous years, the event saw a 45% increase in exhibitors,...
US-based semiconductor packaging and test services provider Amkor Technology announced it will hold a groundbreaking ceremony on October 6, 2025, to officially begin construction of...
The Trump administration pushed for a 50-50 split in chip manufacturing between the US and Taiwan, pressuring TSMC to expand US production. This raises costs and risks for Taiwan's...
US-based foundry GlobalFoundries (GF) has faced numerous challenges in its China strategy, from halting investment in a 12-inch fab in Chengdu to shifting toward mature process partnerships...
Qualcomm is in active discussions with multiple Indian suppliers, including the Tata Group, to leverage the country's semiconductor packaging capacity and is open to collaborating...
Tata Electronics is in discussions with several global semiconductor equipment makers, including Dutch giant ASML and South Korea's JT Corp, to supply its upcoming fabrication plant...
TSMC announced on September 25 that Y.L. Wang has resigned from his role as director and CEO of TSMC Arizona Corporation, effective October 1. Wang's departure marks the completion...
