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    China leads nuclear power revival as US and Europe talent and supply chain gaps widen
    1h 33min ago
    Japanese automakers reintroduce US-spec left-hand drive cars to domestic market amid trade tensions
    1h 34min ago
    Samsung's Taylor fab to focus on HPC and automotive chips, foundry clients rise to 121
    1h 34min ago
    Nvidia conducted final verification visits to Samsung's Cheonan packaging plant for HBM4 supply
    1h 34min ago
    Sercomm expects memory shortages and price hikes to last until end of 2026
    1h 34min ago
    OpenClaw surge drives Mac mini shortage in China with high computing costs
    1h 47min ago
    NEWS TAGGED EXPANSION
    Monday 2 February 2026
    Kinsus approves US$744M ABF expansion on clear three-year demand outlook
    Kinsus, the IC substrate arm of Pegatron, has approved additional project-based capital spending totaling NT$23.5 billion (approx. US$744 million) to support ABF substrate equipment...
    Monday 2 February 2026
    Taiwan restarts offshore wind expansion, resetting strategy with 2026 floating turbine demo
    After years of disruption, Taiwan's offshore wind sector is approaching a decisive inflection point in 2026. Development momentum was previously slowed by labor shortages during the...
    Monday 2 February 2026
    SMIC reportedly sets up advanced packaging research institute in Shanghai
    As Intel, Samsung Electronics, and TSMC increase investment in advanced packaging, market sources say SMIC has set up an advanced packaging research organization in Shanghai, with...
    Monday 2 February 2026
    Semco's Tianjin MLCC plant capacity runs flat out on EV, AI server expansion
    Rising automotive electronics demand has pushed Samsung Electro-Mechanics (Semco)'s Tianjin plant to full capacity across its multilayer ceramic capacitor (MLCC) production lines,...
    Monday 2 February 2026
    National Aerospace Fasteners begins phase two expansion in Malaysia, targets 1H28 operation with smart manufacturing
    Taiwan-based National Aerospace Fasteners Corporation (Nafco) held a groundbreaking ceremony on January 30, 2025, for its second-phase expansion at its production base in Malaysia...
    Monday 2 February 2026
    Micron ramps global memory investments as Nvidia prepares HBM4 rollout

    As Nvidia prepares to adopt its sixth-generation HBM4, Micron has taken a quieter approach to supply timelines compared with Samsung Electronics...

    Sunday 1 February 2026
    LMOC ramps silicon photonics output with new MOCVD expansion plan
    LandMark Optoelectronics Corporation (LMOC) reported strong fourth-quarter 2025 performance, driven by a sharp ramp in silicon photonics (SiPh) shipments, with all three profitability...
    Friday 30 January 2026
    AI integration drives cautious optimism in global collaborative robot market
    The collaborative robot (cobot) industry, a pivotal segment for artificial intelligence (AI) applications, anticipates new growth opportunities despite a weak economic recovery, according...
    Thursday 29 January 2026
    Foxconn Industrial Internet drives growth in high-end computing market through cloud and AI server focus
    Foxconn's subsidiary, Foxconn Industrial Internet (FII), is accelerating its operational shift toward the high-performance computing market, driven by dual engines of cloud and AI...
    Thursday 29 January 2026
    Exclusive: TSMC reshapes advanced packaging expansion, shifting AP8, AP7, and US fab plans
    The surge in generative AI (GenAI) and high-performance computing (HPC) demand has pushed advanced semiconductor packaging to become the most critical and constrained capacity bottleneck...
    Thursday 29 January 2026
    Celestica posts sharp revenue gains as cloud and AI spending rise

    Celestica, a global supplier of data center infrastructure and advanced technology manufacturing, reported sharply higher revenue and...

    Wednesday 28 January 2026
    Powertech will invest NT$43.3 billion to accelerate FOPLP, targets mass production in 1H27
    In response to growing demand from AI and high-performance computing (HPC) for advanced packaging capacity such as fan-out panel-level packaging (FOPLP), Powertech chairman DK Tsai...
    Wednesday 28 January 2026
    Corning signs up to US$6 billion supply agreement with Meta for US data center expansion
    Corning and Meta Platforms have agreed to a multiyear deal valued at up to US$6 billion to supply optical fiber, cable, and connectivity solutions for Meta's US data center expansion...
    Wednesday 28 January 2026
    TI accelerates capacity push, shrugs off memory shortages
    Texas Instruments (TI) signaled urgency around capacity planning, stressing that today's capital spending choices will determine its ability to serve demand years ahead, while downplaying...
    Tuesday 27 January 2026
    TSMC and Nvidia ignite AI growth, Taiwan supply chain accelerates expansion
    With strong demand for AI servers, TSMC—holding the vast majority of AI chip orders—is executing major expansions in advanced process technology and packaging capacity...
    6/47 pages
    Research Report Database
    BIZ FOCUS
    Feb 9, 08:00
    iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
    Friday 6 February 2026
    2026 Market Outlook: Key Opportunities & Risks to Watch
    Thursday 5 February 2026
    Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
    Wednesday 4 February 2026
    Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
    biz
    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook