SoftBank Group plans to invest up to US$3 billion to turn a former electric-vehicle plant in Lordstown, Ohio, into a manufacturing hub for OpenAI's modular AI data-center hardware...
Fujifilm President Teiichi Goto announced on November 14, 2025, in Tokyo that the company plans to establish a semiconductor materials manufacturing facility in India. The factory...
Samsung Electronics planned a US$1.9 billion investment to upgrade its wafer foundry in Austin, Texas, aiming to produce Apple's next-generation CIS chips starting late 2026. The...
Samsung Electronics posted a sharp rebound at its Austin semiconductor plant in the third quarter of 2025. The results signal renewed momentum for the company's US foundry operations...
Gold Circuit Electronics (GCE), a major manufacturer of networking and server printed circuit boards (PCBs), announced the approval of two capex projects totaling NT$8.5 billion (approx...
Global automotive supply chains remain under pressure as disruptions linked to Nexperia, a Netherlands-based chipmaker, continue to affect major automakers and suppliers.
In recent years, Taiwan's automotive component makers have aggressively expanded into adjacent high-growth sectors, including thermal modules for AI servers and parts for semiconductor...
Taiwan's minimally invasive surgical device maker Lagis Enterprise has completed its second factory, three times the size of its original facility. Chairman Cheng-hung Chen said the...
Samsung's P5 plant at the second campus in Pyeongtaek, South Korea, will begin construction, with operations expected to start in 2028. Due to the weak memory market, P5 was previously...
Dynamic Holding, a leading producer of automotive printed circuit boards (PCBs), is gearing up for a surge in artificial intelligence (AI) computing demand from application-specific...
The wave of panel-factory shutdowns continues, with AUO Corp. confirming the sale of another facility. On November 14, the company said it will dispose of its Hsinchu L3C plant and...
SK Hynix is reportedly set to begin ordering equipment for its 12-layer sixth-generation high-bandwidth memory (HBM4) as early as November 2025. Considering the construction schedule...
Amid the global surge in AI data center construction, reported delays in third-party data center projects in the US have highlighted hidden infrastructure bottlenecks resulting from...
