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    Hyundai Motor Group expands US research unit ahead of EREV and HEV push
    Sep 3, 18:26
    Commentary: Apple shifts to smart vehicle software layer as Ternus era arrives
    Sep 3, 18:26
    Kyocera opens first new Japan plant in 21 years to tap Kyushu chip supply chain
    Sep 3, 18:26
    CPO testing shifts upstream as equipment makers vie for integration lead
    Sep 3, 18:26
    NEWS TAGGED EQUIPMENT
    Thursday 13 November 2025
    Fonontech - Discover the impact of Impulse Printing for fast 3D interconnects

    Fonontech B.V. is a device solution provider and startup company based on Impulse Printing technology. Impulse printing technology can be described as a novel additive...

    Thursday 13 November 2025
    Boschman - providing packaging solutions for auto & industrial power modules

    Founded in 1987, Boschman Technologies B.V. is a manufacturer of sintering equipment and transfer molding technology for advanced packaging of automotive and industrial...

    Wednesday 12 November 2025
    Piotech leads growth as Chinese chip equipment makers post mixed 3Q25 results
    Major semiconductor equipment makers in China reported mixed results in the third quarter of 2025. Naura posted the highest revenue in the third quarter of 2025, while Piotech delivered...
    Wednesday 12 November 2025
    EU moves to ban Chinese telecom gear, push unified cybersecurity standards
    The EU is actively discussing legislation to prohibit Chinese telecommunications equipment from entering member states, aiming to strengthen regional information security defenses...
    Wednesday 12 November 2025
    TSMC offloads older tools to VIS as it repurposes fabs for next-gen tech
    Taiwan Semiconductor Manufacturing Company (TSMC) approved its third-quarter 2025 business report and financial statements during a board meeting on November 11. The company also finalized...
    Tuesday 11 November 2025
    Samsung's Texas expansion spurs formation of a new US semiconductor ecosystem

    Samsung Electronics is ramping up its semiconductor foundry expansion in Taylor, Texas, aiming for full operation by 2026. The move has...

    Tuesday 11 November 2025
    ASML tackles AI's 'scissor gap' with dual-track chip strategy
    ASML EVP and China head Shen Bo said artificial intelligence is redefining the global semiconductor landscape, pushing chipmakers and equipment suppliers to balance growing computing...
    Tuesday 11 November 2025
    China's Unicomp targets global expansion with US$37.5M purchase of SSTI semiconductor

    Unicomp Technology Group, a Wuxi-based industrial inspection equipment maker, said its wholly owned unit, Ray Tech Singapore, will acquire...

    Monday 10 November 2025
    ASML says AI boom has yet to lift chip equipment demand
    Nvidia and TSMC are surging ahead in the AI boom, but ASML's growth looks slower in comparison. The Dutch lithography maker expects about 15% sales growth in 2025, while TSMC projects...
    Monday 10 November 2025
    Taiwan semiconductor materials face three major obstacles, says Sunlit exec
    The 10th edition of the Materials Industry Forum kicked off on November 7 in Taiwan under the theme "A Single Tree Cannot Make a Forest: Taiwan's Rising Materials Industry."
    Monday 10 November 2025
    Ableprint reports record third quarter revenue despite regulatory search
    Ableprint, a supplier of advanced semiconductor packaging bubble-removal equipment, reported record-high revenue in the third quarter of 2025, underscoring its strong position in the...
    Sunday 9 November 2025
    Auden Techno turns profitable
    RF antenna maker Auden Techno on November 5 reported consolidated revenue of NT$483 million (approx. US$15.6 million) for the third quarter of 2025, up 15.35% quarter-over-quarter...
    Friday 7 November 2025
    China temporarily halts export controls on rare earths, graphite, and other strategic materials
    China's Ministry of Commerce (MOFCOM) and the General Administration of Customs announced on November 7 that they will suspend the implementation of several export control measures...
    Friday 7 November 2025
    Hanmi to launch Wide TC Bonder for HBM5 high stacking in 2026
    Hanmi Semiconductor announced it will release a dedicated device called the "Wide TC Bonder" by the end of 2026, designed specifically for next-generation high-bandwidth memory (HBM)...
    Friday 7 November 2025
    BOE ramps up 8.6-gen OLED mass production to challenge SDC
    China's leading display manufacturer, BOE, is accelerating its deployment of 8.6-generation OLED production. The first phase of investment is nearly complete, and the company is preparing...
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    BIZ FOCUS
    Sep 2, 08:22
    World Diamond Technology accelerates mass production of 300 mm diamond wafers
    Wednesday 2 September 2026
    Beyond Language: Indonesian Engineers Bridging Cultures in Taiwan's Semiconductor Industry
    Wednesday 2 September 2026
    Innovative Solutions for Fabricating High-Performance AI Multichip Packaging Using Glass Substrates
    Wednesday 2 September 2026
    8 September Hsinchu seminar: Silicon photonics driving AI chains
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