TSMC has unveiled what it claims is the foundry segment's first 100MHz flash memory single-cycle access speed 90nm embedded flash IP targeting a wide range of automotive, communications...
Intel plans to hold an intelligent systems conference in Shenzhen, southern China, during August 15-16 to exhibit its roadmap including intelligent in-car systems and digital monitoring...
Advantech, the embedded platform and iService platform provider, is happy to announce Android 4.0 support on its HIT-W181. HIT-W181 is an 18.5", 16:9 full-flat PCT or multi-touch...
Frankwell Lin, the President of Andes Technology Corporation and a veteran with years of experience in market observation, said despite mainstream in the personal computing market...
AMD has introduced the latest entry to the AMD Embedded G-series processor family with the AMD Embedded G-T16R accelerated processing unit (APU). The AMD G-T16R is targeted at very...
Target at low-power, high-performance, DIN-rail applications. FabiaTech has revealed their latest new product FX5325 small system. It supports MPEG2, MPEG4 and H.264 hardware decoding...
Spansion has started sampling the company's first single-level cell (SLC) NAND flash memory, built using SK Hynix' 4Xnm process technology, and packaged and tested by Spansion itself...
Intel's Atom D525 (Pineview) processor, which has been adopted in industrial PC (IPC) products such as point of sales (POS), digital signage, gambling machines and industrial automation...
Flash memory maker SanDisk is looking to its embedded solutions for future growth, and strives to enhance the product portfolio to fully address the mobile market opportunities.
Embedded non-volatile memory (eNVM) silicon IP developer eMemory Technology has announced its One Time Programmable (OTP) technology, NeoBit, has completed silicon IP verification...
Early March contract prices for NAND flash memory saw a slight decreases to flat growth, mainly due to sluggish demand for memory cards and USB drives. However, with storage devices...
Intel is set to host its Intel Developer Forum (IDF) for China on April 11 in Beijing, China with the market expecting the company will reveal details about its cooperation with China-based...
The features of USB 3.0 - such as rapid data transfer rates, and backward compatibility with USB 2.0/1.1 devices that users do not need to adjust to - has led to uptake rates rising...
The new-generation UEFI firmware architecture offers an integrated environment to accelerate firmware development. Its functions not only cover legacy BIOS, but also improve boot-up...
The development of processors has entered the generation of the "heterogeneous multi-core processor", in which the integration of different types of processors (such as...
