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Tuesday 3 June 2025
BOE's OLED surge stirs déjà vu for South Korea's display sector
BOE Technology Group is fast-tracking its 8.6-generation (8.6G) OLED production line in Chengdu, raising red flags for South Korean display makers. Having already ceded LCD leadership...
Tuesday 3 June 2025
Samsung upgrades capacity layout, reportedly transforming old memory lines into packaging mainstay
Samsung Electronics is reportedly repurposing its existing facilities to bolster its advanced semiconductor packaging capabilities, aiming to enhance competitiveness in the rapidly...
Tuesday 3 June 2025
Huawei defies US sanctions with record revenue and R&D transformation
Huawei posted its second-highest revenue on record as the Chinese telecommunications giant demonstrates resilience despite years of US trade restrictions that have reshaped its business...
Tuesday 3 June 2025
Nittobo announces 20% price increase on fiberglass products
Leading Japanese glass cloth manufacturer Nittobo Boseki announced on June 2, 2025, that it will increase the price of certain fiberglass products in its composite materials business...
Tuesday 3 June 2025
Chip packaging material shortage deepens as top supplier raises prices 20%
Rising artificial intelligence chip demand has strained supplies of critical materials used in advanced semiconductor packaging, with Japan's Nittobo announcing price increases of...
Tuesday 3 June 2025
Exclusive: Renesas to sell near-new SiC gear as EV pivot clouds Taiwan partnerships
Renesas Electronics is reportedly exiting its silicon carbide (SiC) initiative, with Japanese media confirming the company has canceled plans for mass production in early 2025 and...
Tuesday 3 June 2025
South Korean exports to the US and China fall sharply, but semiconductor sales hit record high

South Korea's exports to the US and China tumbled by more than 8% in May, reflecting growing pressures from global trade tensions and...

Tuesday 3 June 2025
US targets EDA exports as Xiaomi’s XRing O1 raises alarm over China’s IC design gains
Xiaomi has launched the XRing O1, claiming to use a 3nm process, while Huawei and Lenovo have successively introduced 5 nm-class chips. The fact that China can still bypass multiple...
Tuesday 3 June 2025
South Korea's chip crown becomes a strategic burden

South Korea's leadership in DRAM, NAND, and high-bandwidth memory (HBM) is becoming a strategic liability amid rising US-China friction. With...

Tuesday 3 June 2025
Modem independence proves elusive as Apple and Xiaomi grapple with custom designs
Apple's first real effort to cut ties with Qualcomm's modem dominance appears to have stumbled out of the gate. Qualcomm commissioned Cellular Insights to run real-world 5G tests...
Monday 2 June 2025
Xiaomi's XRing O1 stirs 'self-developed' chip debate with Arm DNA and custom AI engines
Xiaomi Chairman Lei Jun unveiled the company's debut in-house mobile SoC, the XRing O1, on May 22, calling it Xiaomi's "first answer sheet" in semiconductor design. Built on TSMC's...
Monday 2 June 2025
EDA cutoff lays bare China's design fragility in advanced semiconductors

China's semiconductor sector is reeling from reports that Siemens EDA has been instructed by the US Bureau of Industry and Security (BIS)...

Monday 2 June 2025
China steps up measures to quell auto market chaos
China's car market has been grappling with the fallout from intense competition and cutthroat price slashing, forcing the government to repeatedly intervene. Misleading marketing...
Monday 2 June 2025
Apple's stable foundation and diversified supply reduce tariff impact, but industry experts remain cautious
The US Court of International Trade ruled on May 28, 2025, that US President Donald Trump's reciprocal tariffs are invalid. Yuan-Kai Chung, chairman and president of Audix, commented...
Monday 2 June 2025
Nvidia sees US$8B revenue shortfall as China sales crater, turns to Shanghai R&D for strategic hold
Nvidia revealed on May 29 its fiscal 2026 second-quarter revenue forecast of US$45 billion, with a margin of error of plus or minus 2%.