Hyundai Mobis has announced plans to begin mass production of automotive semiconductors developed in collaboration with over 20 domestic companies and research institutes starting...
Amid its legal battle with Samsung Display (SDC), BOE appears unaffected and is taking a more aggressive stance in the OLED market with the support of the Chinese government and Apple...
At the Apsara Conference 2025, Alibaba announced its AI platform will integrate Nvidia's full physical AI software stack into its developer toolkit. More than a technical update,...
Chinese new energy vehicle (NEV) leader BYD has rapidly gained visibility in Japan through aggressive price competition. However, to convert this visibility into stable market share...
On September 28th, the second day of the 2025 Toyota Gazoo Racing Corolla Cup in Taichung, Toyota Motor Corporation Chairman Akio Toyoda made a surprise appearance—not just...
At the Apsara Conference 2025, Alibaba introduced its PanJiu AI Infra 2.0 with a 128-chip supernode, the most-watched launch of the event. The debut underscores how China's cloud...
Seoul prosecutors have arrested and indicted three former employees of Samsung Electronics for allegedly leaking advanced nanoscale DRAM process technology to China's Changxin Memory...
Starting in 2026, China will require export licenses for electric vehicles (EVs) to address international concerns over dumping and domestic overcapacity. This strategy aims to improve...
With progress in visa negotiations between the South Korean and the US governments, LG Energy Solution (LGES) is poised to accelerate construction and operations at its US factory.
Western Digital (WD), the world's largest hard disk drive (HDD) manufacturer, announced plans to invest US$1 billion in Japan over the next five years to strengthen next-generation...
The 2025 Tokyo Game Show (TGS) set new records in both attendance and exhibition scale, marking a clear shift from a consumer showcase to a business-focused platform. Taiwanese gaming...
Huatie announced the termination of a CNY3.69 billion(US$518.3 million) five-year GPU cloud computing service contract with an undisclosed Hangzhou company after zero deliveries in...
Third-generation semiconductor silicon carbide (SiC) has recently shifted industry focus from the mainstream 6-inch and 8-inch wafers to the more futuristic 12-inch SiC substrates,...
