As advanced packaging technologies and large-size integrated substrate solutions become key development areas for technology firms, glass substrate technology has emerged as a focal...

Thermal management has become an increasingly critical issue as the computing performance of AI chips continues to advance. High temperatures not only lead to slower performance due...

China-based Lenovo has announced plans to begin manufacturing AI servers at its Puducherry plant in southern India and has established a dedicated AI servers R&D lab in Bengaluru...