At the recent Hot Chips 2025 conference, Nvidia detailed its latest GB10 system-on-chip (SoC) architecture, representing a miniaturized application of the Blackwell GPU architecture...
To accelerate the development of heterogeneous integration and advanced packaging technologies, the "3DIC Advanced Manufacturing Alliance" was officially established on September...
TSMC continues to advance its investment plan for the Pingtung Science Park, officially opening the site for vendors to begin construction. Arthur Chuang, vice president of Facility...
The South Korean government is accelerating the development of its hydrogen economy, focusing on three key policy directions: demand market expansion, supply planning, and infrastructure...
At SEMICON Taiwan 2025, AMD Fellow Daniel Ng, who heads the company's OSAT technology development, laid out a stark assessment of the semiconductor industry's next bottleneck: the...
AUO recently announced a collaboration with leading satellite navigation and smart wearable brand Garmin to launch the world's first smartwatch featuring microLED display technology,...
At a SEMICON Taiwan forum on Quantum computing, IBM Japan CTO and Vice President Norishige Morimoto detailed how AI's growing complexity—estimated to have surged by more than...
Hanwha Semitech has announced a new strategic roadmap to strengthen its position in the advanced semiconductor packaging equipment market, unveiling next-generation systems set to...
Seoul, September 12, 2025 – SK hynix Inc. announced today that it has completed development and finished preparation of HBM4, a next generation memory product for ultra-high...
Nitto Denko has entered a joint development agreement with IBM to explore advanced packaging technologies and materials for semiconductor applications. The partnership will focus...
Wistron's board of directors approved a significant increase in the capital expenditure budget for its Fremont, California-based wholly-owned subsidiary WisLab EMS Corporation, doubling...
Renowned chip architect Jim Keller was invited to speak at the SEMICON Taiwan 2025 Master Forum. At the start of his speech, Keller announced that his company, Tenstorrent, will establish...
Merck has pointed out that the semiconductor industry's growth curve has reached a combined output value of EUR650 billion (US$760.4 billion) and is expected to surpass EUR1 trillion...
Apple is preparing to debut vapor chamber (VC) cooling in the upcoming iPhone 17 Pro, with Taiwan's Asia Vital Components (AVC) and China's Suzhou Tianmai Thermal Technology reportedly...
