Memory module maker Adata Technology expects DRAM contract prices to register a double-digit sequential surge in the third quarter of 2021, with an over 15% rise in low-power DRAM...
DRAM chipmaker Nanya Technology has reported revenue of NT$22.64 billion (US$808.9 million) for the second quarter of 2021, the highest in 11 quarters.
Foundry market leader TSMC has been pinpointed as a major beneficiary of the increasingly fierce competition among HPC chip providers, according to market sources.
Memory module firms including Kingston Technology, Adata Technology, Apacer Technology and Team Group all plan to launch their new-generation DDR5 memory series in the second half...
Specializing in industrial flash storage, memory module maker Innodisk is poised to see its second-quarter revenue hit a record high, according to market sources.
Orient Semiconductor Electronics (OSE) is looking to scale up its EMS business beyond the electronics sector, while strengthening its collaboration with backend house Chipbond Technology...
Memory module house Team Group saw its net profit jump more than tenfold on year to NT$141 million (US$5 million) in 2020, with revenue hitting a record high of NT$7.5 billion. EPS...
Samsung Electronics has expanded its DDR5 DRAM memory portfolio with a 512GB DDR5 module based on high-K metal gate (HKMG) process technology, according to the company.
SK Hynix has signed a 5-year contract worth KRW4.75 trillion (US4.3 billion) with ASML to procure extreme ultraviolet (EUV) lithography systems, local media reports in South Korea...
Next-generation DDR5 memory is expected to be employed in consumer electronics devices starting as early as the second half of 2021, despite its still-early stage of deployment, according...
Team Group will put increased focus on the gaming and industrial control segments in 2021, when market conditions will be also favorable to the memory module maker, according to the...
Micron Technology has announced the launch of uMCP5, which the company claims is the industry's first universal flash storage (UFS) multichip package with low-power DDR5 DRAM.
Intel and SK Hynix have signed an agreement under which the latter would acquire the former's NAND memory and storage business for US$9 billion, according to the companies.
