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NEWS TAGGED COPPER
Wednesday 19 May 2010
Chip packagers reportedly to raise quotes on gold costs
Higher gold prices have prompted chip packaging houses to consider transferring rising material costs to customers. Advanced Semiconductor Engineering (ASE) started adjusting quotes...
Tuesday 18 May 2010
Copper foil prices likely to drop in June, say sources
Prices for copper foil, the raw material of copper clad laminates (CCL), are likely to drop 3-4% in June due to recent weakening copper prices, according to industry sources in Tai...
Tuesday 18 May 2010
Backend supplier UTAC says sales of copper wirebonding process growing
United Test and Assembly Center (UTAC) has seen sales generated from copper wire bonding account for 20% of its total revenues, according to company CEO Lee Joon Chung. Apart from...
Thursday 13 May 2010
Copper foil maker Co-Tech looks to ship 15,000 tons of copper foils in 2010, says chairman
Taiwan-based Co-Tech Copper Foil expects its sales of copper foil to top 15,000 metric tons in 2010, increasing 25% from the 12,000 tons shipped in 2009, according to company chairman...
Tuesday 11 May 2010
Co-Tech developing copper foils for electric car batteries
Co-Tech is developing copper foils used in lithium batteries for electric cars, with samples expected to deliver later in the second quarter, according to company chairman Chung-Hsiung...
Tuesday 4 May 2010
PC component makers increasing quotes to handle rising copper prices
Taiwan-based makers of PC cables, power supplies and cooling modules have upwardly adjusted quotes to notebook makers to reflect increased material cost as the international copper...
Monday 3 May 2010
ASE expects higher shipments, gross margin in 2Q10
Chip packaging and testing company Advanced Semiconductor Engineering (ASE) expects shipments to grow by 11-13% sequentially in the second quarter of 2010, driven particularly by...
Friday 30 April 2010
ASE 1Q10 earnings beat market expectations
Chip packaging and testing house Advanced Semiconductor Engineering (ASE) has announced net profits of NT$3.395 billion (US$108 million) on consolidated revenues of NT$37.555 billion...
Thursday 29 April 2010
SPIL posts weaker-than-expected 1Q10 results
Chip packaging and testing house Siliconware Precision Industries (SPIL) saw net profits for the first quarter of 2010 decline 60% sequentially to NT$1.51 billion (US$48.31 million)...
Friday 16 April 2010
Copper interconnect explosion continues, says The Information Network
The long awaited transition to copper interconnects for memory devices skyrocketed in 2009, and will impact nearly every sector of the semiconductor equipment market into 2011, according...
Thursday 8 April 2010
ASE 1Q10 revenues up on quarter, but SPIL down
Chip packaging and testing house Advanced Semiconductor Engineering (ASE) has reported consolidated revenues for the first quarter rose 42.8% sequentially to NT$37.56 billion. Meanwhile,...
Thursday 1 April 2010
Notebook power supply and cooling module makers plan to increase price
Makers of notebook power supplies and cooling modules are preparing to increase their quotes as the rising labor costs in China as well as increasing copper prices are impacting their...
Wednesday 3 March 2010
Co-Tech may raise copper foil prices in March 2010 on strong demand
Copper foil supplier Co-Tech is running at high utilization rates and has received orders for April 2010. The company said it may raise quotes for copper foil in March. The average...
Wednesday 3 March 2010
Leadframe maker SDI to attract investment from material supplier
Shuen Der Industry (SDI) has announced it plans to draw investment via private placement from Mitsubishi Shindoh, which produces copper strips for leadframes. The leadframe maker...
Tuesday 23 February 2010
CCL quotes set to rise in March 2010, say sources
Copper-clad laminate (CCL) quotes are likely to rise in March 2010 to reflect the rising price of copper, according to industry sources. The average copper price has topped US$7,400...