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    Nvidia's interim CEO Colette Kress signals stability first as board weighs future after Huang
    5min ago
    GAO warns of F-35 supply chain risks as 17,000 parts remain unrecorded
    Nov 12, 17:31
    Samsung breaks ground on advanced HBM packaging plant in South Korea
    Nov 12, 17:31
    xFusion enters IPO review with CNY80 billion fundraising plan
    Nov 12, 17:31
    Apple’s iPhone Duo struggles in China’s foldable phone market
    Nov 12, 17:31
    Pegatron targets multiple-fold server growth and hyperscale CSP entry
    Nov 12, 17:31
    NEWS TAGGED COPPER
    Wednesday 11 November 2026
    Samsung targets early 2027 for first 3D Cube-H design kit
    Samsung Electronics aims to complete its first 3D Cube-H design kit, a hybrid copper bonding technology for vertically stacked logic chips, in early 2027, with prospective customer...
    Friday 6 November 2026
    Nvidia reportedly buys glass substrate samples from Korea's JNTC
    South Korea's JNTC has joined Nvidia's purchasing supplier list and is supplying paid samples of through-glass via (TGV) substrates, including 2mm-thick glass cores, The Elec...
    Monday 2 November 2026
    Denso sees profits hit by memory costs, seeks price pass-through
    Denso, Japan's largest auto parts maker, reported falling profits for the first half of fiscal 2026 as surging memory and other component costs, driven partly by the AI boom, offset...
    Thursday 22 October 2026
    High-end ASIC demand drives TGV adoption as TPK weighs further Taiwan expansion
    As advanced packaging technology evolves, traditional copper-clad laminates (CCL) are increasingly running up against signal transmission and thickness limitations. Through-glass via...
    Wednesday 21 October 2026
    DIGITIMES Insights: AI server PCB upgrades drive explosive demand for advanced backdrilling equipment
    DIGITIMES observes that as AI servers and high-speed networking equipment continuously pursue higher data transmission rates, printed circuit boards (PCBs) are being upgraded through...
    Tuesday 20 October 2026
    Micro LED optical interconnect targets AI racks amid unsettled standards
    Surging demand for optical interconnects in AI computing centers is pushing Micro LED technology into short-reach optical transmission inside data center racks. Differing views on...
    Tuesday 20 October 2026
    DIGITIMES Insight: AI packaging power reaches kilowatt scale as thermal design moves toward the die
    Generative AI is pushing chip power consumption and heat flux to unprecedented levels, driving AI packaging thermal management requirements from several hundred watts to the kilowatt...
    Monday 19 October 2026
    MKS' Atotech and ESI to Showcase Advanced PCB Solutions at TPCA 2026

    MKS Inc. (NASDAQ: MKS), a global provider of enabling technologies that transform our world, today announced that its strategic brands Atotech, offering process chemicals,...

    Friday 16 October 2026
    BOE's 24-layer glass substrates reach AI chip packaging trials, with mass production still ahead
    Chinese display manufacturer BOE has made further progress in advanced semiconductor packaging, extending its panel manufacturing expertise to glass-core packaging substrates. At an...
    Thursday 15 October 2026
    Fujifilm to expand Arizona semiconductor materials output
    Fujifilm is expanding semiconductor materials production in Arizona as global chip demand rises, especially for artificial intelligence, advanced logic, and memory. The move aims to...
    Wednesday 14 October 2026
    Hybrid Copper Bonding - A Manufacturing Lever for The AI Era

    The current growth cycle of the semiconductor industry is driven by the demand for logic and memory tied to artificial intelligence (AI), cloud infrastructure, and advanced...

    Saturday 10 October 2026
    JNTC bets US$259 million on glass substrates ahead of 2028 ramp
    South Korea's JNTC plans to invest KRW347 billion (approx. US$259 million) in glass substrate manufacturing as it reports a sharp reduction in copper-filling time for thick glass cores,...
    Tuesday 6 October 2026
    Taiwan bets on SiPh, CPO to tackle AI data center power bottlenecks
    Taiwan's National Science and Technology Council (NSTC) has launched two research programs targeting silicon photonics (SiPh) and next-generation AI data center power systems, seeking...
    Tuesday 6 October 2026
    Jedec unveils new standard for silicon photonics reliability qualification and testing
    Jedec released a new standard for silicon photonics (SiPh) testing and manufacturing controls to promote consistent reliability practices. The standard comes as SiPh experiences rapid...
    Tuesday 6 October 2026
    Marvell sees custom chips as a must for CSPs
    Nvidia CEO Jensen Huang has said Marvell's optical technology could help make it the next trillion-dollar company, and Marvell took a step toward that goal on September 17 by expanding...
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    BIZ FOCUS
    Nov 5, 08:00
    Can Wearable Health Devices Reflect Traditional Chinese Medicine Concepts?
    Tuesday 3 November 2026
    NVIDIA CEO and Sweden's Technology Leaders Discuss Compute's Next Chapter
    Friday 30 October 2026
    Macronix to Showcase Automotive and IoT Memory Solutions at electronica 2026
    Thursday 29 October 2026
    STMicroelectronics to propose the reappointment of Jean-Marc Chery as President & CEO