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    NEWS TAGGED CONVERTIBLE BOND
    Wednesday 23 September 2026
    ZDT prices US$800M ECB to expand AI server PCB push

    Printed circuit board (PCB) maker Zhen Ding Technology (ZDT) Group completed pricing of its sixth overseas convertible bond issue on...

    Tuesday 1 September 2026
    Nvidia and MediaTek link AI technologies in bid to accelerate custom data center chip adoption
    Nvidia and MediaTek are widening a global AI partnership that could reshape data center, edge, and PC hardware markets. MediaTek's US$3.9 billion overseas convertible bond sale, largely...
    Thursday 20 August 2026
    WPG sees chip supply remaining tight into 2027, plans NT$15 billion convertible bond sale

    Taiwan-based IC distributor WPG Holdings expects AI-driven semiconductor demand to remain strong into 2027, with capacity tight across...

    Friday 14 August 2026
    Silicon Motion completes US$1.15 billion zero-coupon bond offering
    Silicon Motion Technology has completed a US$1.15 billion convertible bond sale, giving it fresh capital to support growth and debt repayment. For global investors and chip buyers,...
    Wednesday 20 May 2026
    Phison taps overseas bond market for US$800 million storage push

    Phison Electronics has completed pricing for its first overseas unsecured convertible bond sale, raising US$800 million as the NAND controller...

    Thursday 11 September 2025
    Wistron increases investment in the US, doubling capital expenditure for California subsidiary
    Wistron's board of directors approved a significant increase in the capital expenditure budget for its Fremont, California-based wholly-owned subsidiary WisLab EMS Corporation, doubling...
    Monday 18 August 2025
    Phison profit drops on currency losses as NAND prices rise, CEO flags 2026 supply concerns
    Phison Electronics reported a sharp decline in second-quarter 2025 profit as steep exchange-rate fluctuations eroded earnings, even as revenue climbed on stronger NAND pricing. Net...
    Tuesday 24 June 2025
    Supermicro seeks US$2 billion convertible bond as deals ramp up
    Supermicro Computer Inc. is raising US$2 billion from the sale of convertible bonds, extending a dramatic run of companies tapping the resurgent market to secure cheap capital.
    Thursday 3 January 2019
    Ennoconn to raise fund for IIoT development, says paper
    Industrial PC (IPC) maker Ennoconn, an affiliate of the Foxconn Group, is planning to raise NT$7.2 billion (US$231.12 million) for 2019 with NT$6 billion via issuing convertible bond...
    Monday 18 March 2013
    TSMC to issue corporate bonds overseas, says report
    Taiwan Semiconductor Manufacturing Company (TSMC) plans to issue US$1.5 billion worth of unsecured corporate bonds overseas, according to a recent Economic Daily News report...
    Tuesday 22 November 2011
    Fulltech to issue NT$800 million in convertible bonds
    Fulltech Fiber Glass, a Taiwan-based maker of fiber glass yarn and fabric, has unveiled plans to issue NT$800 million (US$26.7 million) worth of unsecured convertible corporate bonds...
    Wednesday 20 April 2011
    Laser Tek to issue NT$600 million convertible bonds
    Packaging material supplier Laser Tek plans to issue NT$600 million (US$20.63 million) worth of convertible bonds to strengthen its financial capability. The company also plans to...
    Tuesday 29 March 2011
    GET to redeem outstanding convertible bonds
    Green Energy Technology (GET), a Taiwan-based maker of solar-grade polycrystalline silicon wafers, will redeem a mandatory batch of outstanding unsecured convertible bonds issued in...
    Friday 24 December 2010
    Chassis maker Catcher to issue NT$4.5 billion convertible bonds
    Magnesium-alloy chassis maker Catcher Technology plans to issue up to NT$4.5 billion (US$150.6 million) worth of five-year unsecured convertible bonds on the domestic market, the company...
    Thursday 23 December 2010
    Flexium, Taiflex to raise capital for capacity ramp
    Flexible PCB (FPCB) maker Flexium Interconnect and Taiflex Scientific, a supplier of flexible copper-clad laminates (FCCL), have recently revealed plans to raise capital to ramp up...
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    BIZ FOCUS
    Nov 13, 08:00
    APD Opens Shenzhen Facility, Advancing Dual-Plant Integration and Smart Manufacturing
    Thursday 5 November 2026
    Can Wearable Health Devices Reflect Traditional Chinese Medicine Concepts?
    Tuesday 3 November 2026
    NVIDIA CEO and Sweden's Technology Leaders Discuss Compute's Next Chapter
    Friday 30 October 2026
    Macronix to Showcase Automotive and IoT Memory Solutions at electronica 2026