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    NEWS TAGGED CHIPS + COMPONENTS
    Monday 5 January 2026
    Trump orders divestment of EMCORE chip assets, tightening US scrutiny of foreign semiconductor deals
    US President Donald Trump has ordered the divestment of certain semiconductor assets of EMCORE Corporation following a national security review that identified risks linked to foreign...
    Monday 5 January 2026
    India roundup: OSAT players claim legacy packaging price parity

    Indian OSAT players aim for price competitiveness on par with Malaysian rivals, as L&T Semiconductor...

    Monday 5 January 2026
    Taiwan power chipmakers bank on AI data centers and auto orders for 2026 growth
    Taiwan's power semiconductor suppliers are positioning for steady growth through 2026. The momentum comes from two fronts: artificial intelligence data centers adopting new power architectures...
    Monday 5 January 2026
    Taiwan IC design industry faces intensifying G2 pressures in 2026
    Taiwan's integrated circuit (IC) design sector faces intensified challenges as 2026 begins that may push its global revenue ranking to third place, largely due to competitive pressures...
    Saturday 3 January 2026
    Micron and GlobalFoundries strengthen Singapore's position in advanced AI chip manufacturing
    Singapore is drawing a new wave of semiconductor investment as global chipmakers expand advanced manufacturing tied to artificial intelligence infrastructure, reinforcing the city-state's...
    Saturday 3 January 2026
    Analysis: Japan targets advanced packaging to crack TSMC's manufacturing edge
    Japanese semiconductor firms are pivoting toward advanced packaging and alternative lithography as TSMC extends its scale advantage in artificial intelligence chips. TSMC's 3nm and...
    Saturday 3 January 2026
    Chang Wah accelerates Asia expansion as chip packaging booms
    Chang Wah Electromaterials and its affiliate Chang Wah Technology are expanding operations across Taiwan, China, and Malaysia as global chipmakers and packaging houses ramp up capacity...
    Saturday 3 January 2026
    Analysis: Chip boom squeezes device makers as surging component costs threaten margins
    The global semiconductor market is projected to reach US$1 trillion as early as 2026, significantly ahead of previous industry forecasts targeting 2030. The World Semiconductor Trade...
    Friday 2 January 2026
    Memory shortages to persist through 2026 as AI server demand surges

    Global memory markets are expected to remain tight through 2026 as aggressive spending by cloud service providers (CSPs) on AI infrastructure...

    Friday 2 January 2026
    Asus to pause new smartphone launches in 2026, maintain mobile operations
    Smartphone distributors in Taiwan have recently said they are no longer able to obtain Asus handsets through local agents and claimed they had received information indicating that...
    Friday 2 January 2026
    IC substrates and networking PCBs grow; materials and equipment face shortages
    The PCB industry is making large upgrades. The largest beneficiaries of the AI boom are IC substrate makers that are part of the advanced chip packaging supply chain, such as Unimicron...
    Friday 2 January 2026
    Baidu's AI chip unit Kunlunxin confidentially files for Hong Kong IPO
    Baidu is moving forward with plans to spin off its AI chip unit, Kunlunxin, and list it in Hong Kong, highlighting the company's push for semiconductor self-sufficiency. On January...
    Friday 2 January 2026
    CXMT logs first annual profit on DRAM price rebound

    ChangXin Memory Technologies (CXMT) returned to profitability in 2025, recording its first full year of net income after a rebound in global...

    Friday 2 January 2026
    Samsung gains edge in AI memory race after reportedly leading Broadcom system-level tests
    Samsung Electronics' sixth-generation high-bandwidth memory, HBM4, has reportedly posted the fastest operating speeds in a key technology test run by Broadcom. The results strengthen...
    Friday 2 January 2026
    Vietnam urges Intel to boost semiconductor backend capacity
    The Vietnamese government is urging Intel to further grow its semiconductor packaging and testing capabilities in the country, seeking to strengthen the nation's role in the global...
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    BIZ FOCUS
    Jun 1, 08:00
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Friday 29 May 2026
    Datotek Introduces AI PSSD Sustainable Storage Solutions at COMPUTEX 2026
    Thursday 28 May 2026
    AGI Debuts DDR5 R-DIMM and Smart Industrial Solutions at COMPUTEX 2026
    Thursday 28 May 2026
    Retronix Launches Sparrow Hawk Edge AI Computing Platform Worldwide
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook