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Thursday 25 June 2026
Micron forecasts stronger AI-driven growth as strategic agreements reshape memory market
On June 24, Micron Technology reported record fiscal third-quarter results and issued a fourth-quarter forecast that significantly exceeded market expectations, reinforcing investor...
Thursday 25 June 2026
China wafer champion turns to US$1.6B overhaul to stop losses
National Silicon Industry Group, China's leading 12-inch silicon wafer maker, has announced a CNY11.45 billion (US$1.6 billion) capital injection into its core subsidiary Shanghai...
Thursday 25 June 2026
Phison says NAND shortage has no end in sight as orders are booked into 2Q27

Phison Electronics CEO Khein-seng Pua said the NAND flash market is facing a supply crunch with "no end in sight," as AI continues to...

Thursday 25 June 2026
Nvidia and AWS deepen push to simplify AI infrastructure at scale
Nvidia and Amazon Web Services (AWS) are expanding tools that could make it easier for companies worldwide to build and run large-scale AI systems. The changes aim to improve speed,...
Thursday 25 June 2026
SK Group to meet Tesla and SpaceX leadership to pursue AI-infrastructure and memory partnerships
SK Group chairman Chey Tae-won is planning to meet Tesla and SpaceX leadership in the US at the end of June 2026 to advance cooperation on next-generation AI infrastructure, memory...
Thursday 25 June 2026
Techzone builds circular economy to tap rising semiconductor expansion demand
Techzone Technology Materials, a provider of one of Taiwan's few integrated waste treatment, renewable energy, and recycling solutions, is actively addressing the waste treatment demand...
Wednesday 24 June 2026
SK Hynix to issue US$29 billion in new shares for Nasdaq ADR listing on July 10
SK Hynix disclosed in regulatory filings to South Korea's Financial Supervisory Service and the Korea Exchange on June 24 that its board has approved the issuance of new shares worth...
Wednesday 24 June 2026
Global market for advanced chip packaging set for rapid expansion
The market for fan-out panel-level packaging(FOPLP) and glass substrate packaging is set to grow sharply as chipmakers race to support AI and high-performance computing. For global...
Wednesday 24 June 2026
China's LineShine supercomputer tops TOP500, but AI lead remains unclear

China's LineShine supercomputer debuted at No. 1 on the June 2026 TOP500 list, announced at the ISC 2026 conference in Hamburg, becoming...

Wednesday 24 June 2026
Qualcomm, ByteDance talks signal new phase in China AI chip diversification
Qualcomm's reported talks to provide custom chip-design services to TikTok owner ByteDance show how China's AI chip supply chain is moving beyond a simple Nvidia replacement story.
Wednesday 24 June 2026
IBM targets Anderon venture to anchor quantum wafer supply
IBM is building a foundry to produce silicon wafers used in quantum-computing processors, seeking to become an indispensable part of the quantum economy under development. Called Anderon,...
Wednesday 24 June 2026
MediaTek-Global Unichip tie-up talk puts TSMC's AI ASIC ecosystem on watch
Cloud service providers are accelerating in-house AI chip development, lifting demand for application-specific integrated circuits, or ASICs, and reshaping collaboration across the...
Wednesday 24 June 2026
AI supply chain boom fuels Taiwan's investment, exports as GDP growth tops 10% outlook
Taiwan's economy is expected to maintain strong momentum through the second half of 2026, supported by accelerating AI-related investment, resilient exports, and robust demand across...
Wednesday 24 June 2026
Samsung, SK Hynix weigh new Korean chip belt as concerns mount for Yongin cluster

South Korea's government is in talks with Samsung Electronics and SK Hynix over a potential new phase of large-scale semiconductor investments,...

Wednesday 24 June 2026
Samsung eyes Galaxy Ultra for 2nm Exynos 2700

Samsung Electronics' System LSI division is pressing its mobile business to expand adoption of the in-house Exynos 2700 processor beyond...