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    NEWS TAGGED CHIPS + COMPONENTS
    Thursday 25 June 2026
    Micron says AI memory shortage will outlast 2027, locks in US$100 billion customer deals
    Micron Technology expects the global memory market to remain supply-constrained beyond 2027, driven by surging artificial intelligence demand and structural limits on new manufacturing...
    Thursday 25 June 2026
    TSMC-Amkor alliance jolts packaging map as ASE races to expand
    The global semiconductor packaging and testing race is heating up as TSMC recently signed a 10-year agreement with Amkor to expand advanced packaging collaboration in Arizona, drawing...
    Thursday 25 June 2026
    Nvidia CPO roadmap positions TSMC COUPE for next AI infrastructure wave
    Co-packaged optics (CPO) is rapidly emerging as a foundational architecture for next-generation AI infrastructure. With Nvidia's latest Scale-Up CPO switch roadmap now taking shape,...
    Thursday 25 June 2026
    Chinese chip packaging giant JCET plans US$1.1b AI chip packaging plant
    JCET Group is accelerating its AI chip packaging expansion with a CNY7.8 billion (US$1.1 billion) investment in a new advanced packaging and testing plant in Shanghai Lingang, strengthening...
    Thursday 25 June 2026
    China moves to build helium reserve as Nippon Sanso sets over 30% price hike

    Global helium supply is under renewed strain. Nippon Sanso, Japan's largest industrial gas supplier, announced it will raise prices across...

    Thursday 25 June 2026
    TSMC 3nm lead times surpass one year as Samsung faces Intel in foundry push
    As demand for AI chips surges, the battle for foundry orders is heating up. South Korean industry sources say the next 2-3 years will be a critical period for Samsung Electronics'...
    Thursday 25 June 2026
    AI server demand drives sharp price gains in high-end MLCCs
    Rising demand for AI server builds is tightening the global supply of high-end MLCCs, driving steep price increases in China's electronics distribution market and exposing how quickly...
    Thursday 25 June 2026
    ByteDance's reported AI chip orders mark breakthrough for Chinese GPU maker Iluvatar CoreX
    ByteDance's reported plan to purchase at least 50,000 AI inference chips from Shanghai-based GPU developer Iluvatar CoreX could become one of the most significant commercial wins yet...
    Thursday 25 June 2026
    IC design firms race to secure packaging capacity
    IC design firms are scrambling to expand their partner networks as tight packaging and testing capacity remain the most pressing bottleneck in the supply chain. Companies in Taiwan,...
    Thursday 25 June 2026
    Nvidia's Huang puts national security first as he touts an AI factory boom at the annual meeting
    At Nvidia's June 25 annual shareholder meeting, CEO Jensen Huang declared that national security "comes first" wherever it conflicts with commercial opportunity, pledging full compliance...
    Thursday 25 June 2026
    MediaTek, Google reportedly deepen ASIC ties as SerDes race hits 448G
    MediaTek is reportedly strengthening its partnership with Google in ASICs, a move that could increase the scale of future orders and carry implications for AI infrastructure worldwide...
    Thursday 25 June 2026
    Qualcomm integrates Dragonfly data center systems into expanded Hugging Face AI partnership
    Qualcomm Technologies is expanding its partnership with Hugging Face to bring open AI tools from devices to cloud infrastructure, a move that could affect developers and enterprises...
    Thursday 25 June 2026
    SK Hynix eyes record Nasdaq ADR to fund AI memory expansion

    SK Hynix said on June 24 its board approved a plan to issue new shares backing American Depositary Receipts on the Nasdaq Global Select...

    Thursday 25 June 2026
    OpenAI debuts Broadcom-designed, TSMC-built inference chip as model makers diversify silicon
    OpenAI on June 24 unveiled "Jalapeño," its first in-house AI accelerator, co-developed with Broadcom and manufactured by TSMC — the clearest sign yet that leading model...
    Thursday 25 June 2026
    Qualcomm pushes into data center chips with Dragonfly lineup and Meta deal, taking aim at Nvidia
    Qualcomm used its June 24 investor day to unveil a data center chip portfolio and a multi-generation CPU agreement with Meta, a strategic bid to diversify beyond a shrinking smartphone...
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