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NEWS TAGGED CHIPS + COMPONENTS
Monday 20 July 2026
Memory is becoming a national security priority, SK chair warns

The global scramble for AI memory is fast becoming a matter of national economic security, with governments intervening in supply and...

Monday 20 July 2026
Commentary: China's DRAM comes of age with CXMT's IPO — but a trio of hurdles remains

CXMT's STAR Market IPO marks a coming-of-age moment for China's DRAM industry, but the listing is only the beginning. Having proved...

Monday 20 July 2026
Rapidus taps Cadence AI agents to speed 2nm chip design
Japanese foundry Rapidus is integrating Cadence's AI-agent technology into its chip design platform as it seeks to shorten development cycles and attract customers for its planned...
Monday 20 July 2026
Compeq acquires Guanyin site for NT$2.09 billion to expand optical and space data center PCB capacity
HDI PCB maker Compeq Manufacturing has approved the acquisition of a new manufacturing site in Taoyuan's Guanyin Industrial Park for approximately NT$2.09 billion (US$64.5 million),...
Monday 20 July 2026
Samsung preps multi-billion-dollar P5 orders as AI boom speeds up memory demand

Samsung Electronics' latest multi-billion-dollar equipment procurement reflects the company's accelerating investment in AI memory...

Monday 20 July 2026
Intel reassigns global fabs, eyes early 14A and EMIB-T AI wins

Intel has accelerated its global footprint reset for 2026 after receiving investments from the US government, SoftBank, and Nvidia...

Monday 20 July 2026
Weekly news roundup: AI chip race widens across silicon photonics, HBM, memory fabs, and frontier models

AI competition is widening from chips to connectivity, memory, talent, patents, and model access,...

Monday 20 July 2026
AI boom pushes PCB, passive component lead times into a new normal

The global wave of AI data center construction continues to accelerate, driving structural growth across the PCB and passive component...

Monday 20 July 2026
Interview: AI race is now a financing race, and Compute Labs wants to bankroll GPUs
As AI's bottleneck shifts from chips to capital, Compute Labs pitches GPUs as financeable assets.
Monday 20 July 2026
TSMC expansion strengthens Arizona's talent pull as advanced manufacturing shifts west
TSMC's ability to attract talent extends beyond Taiwan to the US, as its additional US$100 billion investment in Arizona for advanced manufacturing facilities is expected to further...
Monday 20 July 2026
Merck ramps up AI semiconductor materials push as Level Up nears completion

AI is redrawing the rules of semiconductor competition, pushing materials suppliers beyond simple chemical inputs and toward integrated...

Monday 20 July 2026
Exclusive Interview: Inside VSMC's Singapore fab, where silicon interposers and power chips underpin AI growth

TSMC raised its 2026 capital expenditure forecast to US$60–64 billion during its second-quarter earnings conference, with a substantial...

Monday 20 July 2026
Jensen Huang's week in Tokyo: what Nvidia's Japan trip reveals about future partners
Nvidia founder and CEO Jensen Huang spent last week in Tokyo meeting government officials, robotics makers and dozens of supply chain executives, as the company deepens its push into...
Monday 20 July 2026
Networking demand remains resilient, but component shortages threaten shipment schedules

AI data center expansion and high-speed network upgrades continue to support demand for networking equipment. However, as the industry...

Monday 20 July 2026
CXMT's US$4B IPO fuels DRAM capacity race toward 350,000 wafers a month

Chinese DRAM maker ChangXin Memory Technologies (CXMT) is accelerating construction and technology upgrades across its manufacturing...