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Tuesday 3 June 2025
Samsung upgrades capacity layout, reportedly transforming old memory lines into packaging mainstay
Samsung Electronics is reportedly repurposing its existing facilities to bolster its advanced semiconductor packaging capabilities, aiming to enhance competitiveness in the rapidly...
Tuesday 3 June 2025
TSMC denies Middle East fab rumors, stays mum on potential price hikes
Taiwan Semiconductor Manufacturing Company (TSMC) chairman C.C. Wei firmly denied speculation that the company is considering setting up a fab in the Middle East.
Tuesday 3 June 2025
TSMC eyes record-high 2025 revenue despite currency hit and tariff pressures, says chair
Taiwan Semiconductor Manufacturing Company (TSMC) chairman C.C. Wei addressed key concerns on June 3, 2025, during a shareholder meeting, touching on currency volatility, global trade...
Tuesday 3 June 2025
TSMC and UMC struggle with strong NT$; Largan faces record foreign exchange losses
The tariff war has temporarily paused, but the biggest challenge currently facing the semiconductor and technology industries is the sharp appreciation of the New Taiwan dollar (NT$)...
Tuesday 3 June 2025
Taiwan AI export surge faces 2H25 reality check after tariff-driven rush
As much of the world's manufacturing sector stalls under macroeconomic strain and geopolitical uncertainty, Taiwan is experiencing an extraordinary export boom—driven not by...
Tuesday 3 June 2025
Nittobo announces 20% price increase on fiberglass products
Leading Japanese glass cloth manufacturer Nittobo Boseki announced on June 2, 2025, that it will increase the price of certain fiberglass products in its composite materials business...
Tuesday 3 June 2025
Chip packaging material shortage deepens as top supplier raises prices 20%
Rising artificial intelligence chip demand has strained supplies of critical materials used in advanced semiconductor packaging, with Japan's Nittobo announcing price increases of...
Tuesday 3 June 2025
Samsung recruits former TSMC, NXP exec to lead US foundry push
Samsung Electronics' Device Solutions (DS) division has appointed former TSMC and NXP Semiconductors executive Margaret Han as vice president of its North American wafer foundry business,...
Tuesday 3 June 2025
Flexium Interconnect pushes forward in AI server while rejoining Apple suply chain amid transformation challenges
Flexible printed circuit (FPC) maker Flexium Interconnect is navigating a critical phase of transformation as it shifts its business focus toward next-generation technologies. While...
Tuesday 3 June 2025
Tata Electronics reportedly eyes Malaysia for semiconductor acquisition to bolster ATMP capabilities

Tata Electronics is reportedly in advanced talks to acquire a semiconductor facility in Malaysia,...

Tuesday 3 June 2025
Exclusive: Renesas to sell near-new SiC gear as EV pivot clouds Taiwan partnerships
Renesas Electronics is reportedly exiting its silicon carbide (SiC) initiative, with Japanese media confirming the company has canceled plans for mass production in early 2025 and...
Tuesday 3 June 2025
US targets EDA exports as Xiaomi’s XRing O1 raises alarm over China’s IC design gains
Xiaomi has launched the XRing O1, claiming to use a 3nm process, while Huawei and Lenovo have successively introduced 5 nm-class chips. The fact that China can still bypass multiple...
Tuesday 3 June 2025
Zhen Ding sees tariff risk as minimal, but braces for forex losses

Zhen Ding Technology, the world's leading printed circuit board (PCB) manufacturer, held its 2025 annual shareholders' meeting on May...

Tuesday 3 June 2025
South Korea's chip crown becomes a strategic burden

South Korea's leadership in DRAM, NAND, and high-bandwidth memory (HBM) is becoming a strategic liability amid rising US-China friction. With...

Monday 2 June 2025
Nanya targets 4Q25 profitability as DDR4 rivals exit
Both AI and non-AI demands in the DRAM market are showing gradual recovery signs. Nanya estimates that it will clear all inventory before the third quarter of 2025. With yield improvements...