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Saturday 25 July 2026
Taiwan's chip partnerships widen beyond fabs to AI, photonics and quantum
Taiwan's semiconductor industry is expanding overseas while deepening cooperation with the US, Europe, and Asia across advanced packaging, AI infrastructure, research, talent, cybersecurity,...
Saturday 25 July 2026
Huaqin's growing stake in Nexchip shows ODMs reaching upstream into chipmaking
Huaqin Technology, the world's largest consumer-electronics original design manufacturer, has again increased its stake in Chinese foundry Nexchip Semiconductor, underscoring how contract...
Saturday 25 July 2026
NAND price rally enters plateau as supply stays tight despite weaker spot demand
The pace of NAND Flash price increases has moderated in the second half of 2026, prompting speculation that the memory market may be approaching a turning point. Supply-chain sources,...
Saturday 25 July 2026
Hisense expands AI strategy into energy, chips, and automotive electronics
Hisense outlined a broader AI strategy at its global partner conference in New York, saying it will expand beyond home appliances into semiconductors, smart energy, laser displays,...
Saturday 25 July 2026
Transcend posts record NT$11.9 billion profit in 2Q26, surpassing any prior full-year earnings
Memory module maker Transcend Information posted record-high profit in the second quarter and first half of 2026. Second-quarter consolidated revenue reached NT$18.82 billion (approx...
Saturday 25 July 2026
South Korea unveils AI cooperation agenda as Nvidia partnerships expand
South Korean President Lee Jae Myung launched an AI-focused visit to Silicon Valley by announcing a "San Francisco AI Declaration" aimed at promoting international cooperation in artificial...
Saturday 25 July 2026
South Korean leaders meet Nvidia as AI partnerships expand
South Korean President Jae Myung Lee, senior government officials, business executives, and researchers gathered in San Francisco this week for an AI summit with Nvidia and industry...
Saturday 25 July 2026
Intel, China-based Lens Technology partner to explore glass substrate semiconductor packaging
Intel Corporation and Lens Technology have announced a strategic collaboration to explore the development of advanced semiconductor packaging technologies using glass substrates. The...
Friday 24 July 2026
SK Hynix seeks US engineers for 3D stacked DRAM push

SK Hynix is recruiting engineers in San Jose to co-design 3D stacked DRAM-on-logic with US customers, extending its custom memory strategy...

Friday 24 July 2026
Huawei founder endorses Tau Law as sole path for post-Moore chip development

Huawei founder Ren Zhengfei has publicly endorsed the company's τ (tau) Law as Huawei's sole technological path for advancing semiconductor...

Friday 24 July 2026
German chip suppliers deepen ties with Samsung, SK Hynix

Germany's Merck KGaA, TRUMPF and ZEISS are deepening their ties with South Korea's semiconductor industry amid large-scale investment...

Friday 24 July 2026
Samsung Electro-Mechanics wins US$200 million AI server capacitor order

Samsung Electro-Mechanics disclosed on July 23 that it signed a KRW295.12 billion (US$200 million) supply contract with a major global...

Friday 24 July 2026
India's chip plants face harder test: finding repeat customers
India's first major semiconductor customers are likely to come through existing global supply chains rather than domestic electronics brands immediately replacing imported components,...
Friday 24 July 2026
AMD says AI shift to inference and agents will reshape data centers
AMD said the artificial intelligence boom is entering a new phase that will force a major redesign of data centers, as demand shifts from model training toward inference, AI agents,...
Friday 24 July 2026
TSMC's Arizona expansion moves past initial hurdles as fabs and packaging ramp up
Since TSMC announced in 2020 that it would build factories in the US, the market has closely watched how overseas fab costs would affect operations. TSMC's long-running Arizona buildout...