News tagged Chips + components at DIGITIMES

NEWS TAGGED CHIPS + COMPONENTS

Monday 27 July 2026

Samsung bolsters energy team as chip projects test power supply

Samsung Group is recruiting current and former government energy officials for its in-house think tank as electricity infrastructure emerges as a key issue for its semiconductor expansion...

Monday 27 July 2026

AI demand, aluminium foil costs trigger rare capacitor price rises across China, Japan and Taiwan

Rising raw material costs and tightening supply of high-end components for AI applications have triggered an unusual round of price...

Monday 27 July 2026

Apacer 2Q26 profit tops full-year record on memory shortage

Memory module maker Apacer Technology posted record quarterly profit in the second quarter of 2026, lifted by the memory shortage and surging prices. Net profit reached NT$2.7 billion...

Monday 27 July 2026

ZDT-led China PCB expansion tops US$10 billion on AI server and edge AI demand

China's printed circuit board (PCB) industry is entering a new investment cycle, with more than CNY70 billion (approx. US$10.3 billion)...

Monday 27 July 2026

eSSD contracts surge as AI data centers shift spending from memory to storage

Enterprise SSDs are emerging as a bigger priority in AI infrastructure as generative AI workloads move from training to inference and data centers need faster storage. Reports from...

Monday 27 July 2026

Disco lifts first-half profit forecast on steady AI equipment demand

Japanese semiconductor equipment maker Disco expects net profit for the six months ending September 30, 2026, to rise 32% year over year to JPY73.8 billion (approx. US$461 million),...

Sunday 26 July 2026

Toshiba cuts Kioxia stake as memory maker's valuation swings

Toshiba reduced its holding in Kioxia Holdings to 15.1% as of July 15, according to filings reported by Nikkei and Reuters. The change report, submitted to Japan's...

Sunday 26 July 2026

Optical PD volume production lifts WIN Semiconductors' Q2 revenue 39% YoY

WIN Semiconductors, a gallium arsenide (GaAs) foundry, reported consolidated revenue of NT$5.26 billion (US$178 million) for the second quarter of 2026, up 14.5% sequentially and 39%...

Sunday 26 July 2026

KKR plans gradual exit as LCY Group accelerates semiconductor materials expansion

TSMC supplier LCY Group President Bowei Lee said private equity firm KKR & Co. plans to gradually divest its holdings in businesses affiliated with the Taiwanese chemical group,...

Sunday 26 July 2026

Pantheon Electric expands copper platform as AI and grid demand tighten supply

Pantheon Electric said it has completed the acquisition of four manufacturers and built an integrated power infrastructure platform across 21 factories in North America and Europe...

Sunday 26 July 2026

Podcast highlights: TSMC, SK Hynix, Intel face AI chip and cash flow inflection

This excerpt from DIGITIMES analyst Luke Lin's podcast covers two major themes: SK Hynix's openness to building in the US and the logic behind TSMC's extra US$100 billion investment...

Saturday 25 July 2026

SK Hynix and Nvidia strike long-term deal to co-develop next-generation HBM

SK Group and Nvidia have announced a comprehensive partnership valued at more than $500 billion, spanning AI factory construction and next-generation memory supply, with letters of...

Saturday 25 July 2026

Samsung, SK, Hyundai join Jensen Huang and Korea's President Lee at San Francisco AI Summit

South Korean President Lee Jae-myung and a delegation of the country's most powerful business leaders convened with NVIDIA founder and CEO Jensen Huang in Silicon Valley this week,...

Saturday 25 July 2026

89 fabs by 2030, 50 more by 2035: chip industry spreads risk through global collab

AI infrastructure investment is reaching unprecedented levels, with estimates showing it will lift global semiconductor output past...

Saturday 25 July 2026

Rapidus links 2nm chips, HBM and advanced packaging in AI foundry strategy

Rapidus is treating advanced packaging as a central part of its 2nm foundry strategy, not a downstream assembly service. The Japanese chipmaker aims to connect design enablement, front-end...

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