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NEWS TAGGED CHIPS + COMPONENTS
Wednesday 21 January 2026
TSMC capacity crunch signals opportunity for Samsung's advanced nodes

The explosive demand for AI chips has created a rare production bottleneck for TSMC's advanced 3nm process, with capacity fully booked...

Wednesday 21 January 2026
Samsung reportedly exploring ASMPT for TCB supply
Samsung Electronics is reportedly diversifying its supply chain for thermal compression bonders (TCB), a critical tool in high-bandwidth memory (HBM) production, by engaging Singapore-based...
Wednesday 21 January 2026
AI demand boosts Unimicron and Nan Ya PCB profits in December 2025
The IC substrate industry is accelerating its recovery into a new bull cycle, driven by steady growth in AI-related application demand. At the same time, price increases are gradually...
Wednesday 21 January 2026
Siemens acquires ASTER to strengthen PCBA test and DFM capabilities
Siemens has acquired ASTER Technologies, a privately held provider of printed circuit board assembly (PCBA) test verification and engineering software, as it moves to expand its electronic...
Wednesday 21 January 2026
Commentary: Taiwan secures most-favored-treatment with tariffs but loses investment edge in China and Vietnam
On January 16, 2026, Taiwan and the US finalized a trade agreement that cuts tariffs on Taiwanese exports to the US to 15% without stacking. The US also pledged most-favored-nation...
Wednesday 21 January 2026
Jabil invests in semiconductor power systems, expanding chipmaking footprint
Jabil Inc., the global manufacturing and supply-chain services company, said on Tuesday that it had made a strategic minority investment in Eagle Harbor Technologies, a Seattle-based...
Wednesday 21 January 2026
2nm mobile SoC era begins with Xiaomi 18 flagship launch
The year 2026 is set to mark the commercial debut of 2nm mobile SoCs, with Qualcomm, Apple, and MediaTek among the first to release 2nm process chips for smartphones. The market expects...
Wednesday 21 January 2026
Memory shortage impacts Chinese smartphone supply; mid-to-low-end models and SoCs face challenges in 2026
Due to memory shortages and price hikes, Chinese smartphone brands are expected to reduce their 2026 inventory by at least 10%, mainly affecting cost-sensitive mid-to-low-end models...
Wednesday 21 January 2026
Google Chromebook aims for steady 2026 shipments despite memory supply challenges
Supply chain sources report that Chromebook shipments have stabilized under Google's support. Despite facing a memory market turmoil, Google has set a full-year shipment target of...
Wednesday 21 January 2026
Vietnam begins construction of first domestic semiconductor plant
Vietnam has officially begun construction of its first homegrown semiconductor chip manufacturing facility, marking a significant step in the country's plans to develop a domestic...
Wednesday 21 January 2026
Intel recruits Qualcomm GPU chief to lead future AI PC efforts
Intel has poached Eric Demers, a veteran GPU architect, known for developing Qualcomm's proprietary Adreno GPU architecture. Demers will become Intel's senior vice president of GPU...
Wednesday 21 January 2026
Thailand emerges as ASEAN PCB hub with Zhen Ding Tech's US$2.1B investment
Thailand's Board of Investment (BOI) recently approved a major investment plan led by Zhen Ding Tech (ZDT), the world's largest printed circuit board (PCB) manufacturer, in partnership...
Wednesday 21 January 2026
Nvidia challenges Apple's longtime TSMC priority

Apple is losing the preferential access it held for more than a decade at TSMC as surging demand for AI chips shifts the balance of power...

Wednesday 21 January 2026
China's semiconductor equipment leaders push HBM autonomy as US tightens restrictions
US export restrictions on advanced semiconductor equipment to China have become the biggest obstacle to China's domestic production of high-bandwidth memory (HBM). It has been reported...
Wednesday 21 January 2026
China's AI industry reshapes as GPUs rise to be core strategic asset
As geopolitical tensions escalate, China's AI industry development is shifting from the application layer to underlying computing power and core chip technologies, with GPU- and AI...