News tagged Chips + components at DIGITIMES

NEWS TAGGED CHIPS + COMPONENTS

Monday 26 May 2025

Yageo's bid for Shibaura: landmark M&A precedent in Japan

The ongoing takeover battle for Japan's Shibaura Electronics between Taiwan-based Yageo Corporation and its Japanese white knight, MinebeaMitsumi, has emerged as a critical case study...

Monday 26 May 2025

Zhen Ding eyes server market as Foxconn-Nvidia alliance signals new AI chapter

In a landmark announcement at Computex this week, Nvidia CEO Jensen Huang unveiled plans to partner with Foxconn in establishing Taiwan's...

Monday 26 May 2025

Taiwan's President Lai calls for resilient chip alliances to counter dumping and fortify innovation

Taiwan's President Ching-te Lai, speaking at the Global Semiconductor Supply Chain Partnership Forum held in Taipei on May 23, warned that the semiconductor industry is facing increasing...

Monday 26 May 2025

Innatera's Pulsar: first neuromorphic RISC-V MCU, TSMC-fabbed for edge AI era

Innatera, a Dutch semiconductor company, has unveiled Pulsar—the world's first mass-market neuromorphic microcontroller tailored...

Monday 26 May 2025

TSMC's advanced packaging booms on Middle East AI orders, boost by Apple's WMCM

Semiconductor industry analysts project a bright future for TSMC's advanced packaging systems, driven by significant demand from the Middle East for AI-centric CoWoS chips and Apple's...

Monday 26 May 2025

Nvidia reportedly develops new lower-cost AI chip for China to skirt US export curbs

Nvidia is reportedly developing another lower-cost AI chip for China, pricing it at US$6,500–8,000—well below its restricted H20 model. The new GPU, based on Blackwell...

Monday 26 May 2025

Weekly news roundup: Huawei's 5G lead, DeepSeek's LLM moves, and TSMC's packaging gap

These are the most-read DIGITIMES Asia stories from the week of May 19 – May 25. Highlights include China's accelerating push for tech self-sufficiency with new AI...

Monday 26 May 2025

Xiaomi enters 3nm race, but Lei Jun says it's no Apple showdown

Xiaomi has launched its first self-designed 3nm system-on-chip, the XRing O1, positioning it as the cornerstone of a broader push into advanced semiconductors. Debuting inside both...

Monday 26 May 2025

Xiaomi takes aim at MediaTek with 3nm XRing O1 breakthrough

Xiaomi's launch of the XRing O1 at its "New Starting Point" event in Beijing marked more than just a new chip release—it was a direct challenge...

Monday 26 May 2025

India roundup: Taiwan-India silicon ties and the global chip chessboard

Taiwan and India are deepening their industrial ties as Foxconn, Inventec, Phison, and Sino-American Silicon expand their India investments; however, TSMC had previously turned down...

Monday 26 May 2025

Vietnam rising: Meiko fuels Apple’s decoupling with $351m expansion

Japanese PCB maker Meiko is ramping up its capex to JPY51 billion (US$351 million) for the fiscal year ending March 2026—a 70% increase from its earlier plan—as it accelerates...

Saturday 24 May 2025

Memory rally lifts 3Q; Team, Transcend turn to edge AI

Benefiting from tariffs and rising memory prices, customers have accelerated urgent order shipments, leading to optimistic operational growth for memory module manufacturers in the...

Friday 23 May 2025

TSMC's VisEra boosts SiPh; CIS grows while MOE declines

VisEra, an optical component manufacturer under TSMC, held its shareholders meeting to outline its outlook for 2025. Chairman Robert Kuan told reporters that revenue growth will primarily...

Friday 23 May 2025

Wolfspeed's stumble opens the door to China's SiC ambitions

In a development that has sent shockwaves through the global semiconductor industry, US-based silicon carbide (SiC) leader Wolfspeed...

Friday 23 May 2025

What does Foxconn’s chip bet in France mean for Europe’s tech future?

Foxconn, the world's largest electronics manufacturing services provider, has partnered with French defence and aerospace group Thales to establish a EUR250 million (US$272 million)...

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Aug 5, 11:49

Cultivating OCP, embracing open source

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