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NEWS TAGGED CHIPS + COMPONENTS
Wednesday 12 August 2026
Haechitech enters eSSD sensors as it prepares Kosdaq listing

South Korean sensor IC designer Haechitech is moving beyond smartphone compass chips into enterprise solid-state drive temperature sensors,...

Wednesday 12 August 2026
Nichidenbo sees MLCC supply tightness as AI pushes lead times to 36 weeks

Passive component distributor Nichidenbo said supply of MLCCs and other products remains tight as AI servers and ASIC applications...

Wednesday 12 August 2026
OCP APAC 2026: TSMC says AI advanced packaging enters system-level battle

AI computing demand is rapidly driving up chip integration complexity, pushing advanced packaging competition beyond single-device...

Wednesday 12 August 2026
SPIL breaks ground on NT$100B Douliu plant, targeting operations in 2028

Siliconware Precision Industries (SPIL), a subsidiary of ASE Technology Holding (ASEH), broke ground on a new plant in Douliu, Yunlin...

Wednesday 12 August 2026
South Korea deepens semiconductor ceramics collaboration amid chip industry expansion

South Korea is moving to reinforce its semiconductor materials and components ecosystem as chipmakers accelerate capacity expansion...

Wednesday 12 August 2026
Fudan's single-electron memory breakthrough opens new path for 2D chip scaling
China's effort to advance memory technology has gained a new research avenue, with a Fudan University team developing a room-temperature single-electron non-volatile memory device...
Wednesday 12 August 2026
Lumentum targets US$2B quarterly run rate as optical capacity expansion accelerates

Lumentum Holdings said it is pulling forward capacity investments across lasers, transceivers, and optical circuit switches (OCS) after...

Wednesday 12 August 2026
OCP APAC 2026: ASE unveils AI packaging trilogy

Demand for AI infrastructure is forcing chipmakers and data-center operators to rethink how systems are built, with implications for...

Wednesday 12 August 2026
Samsung HBM4 yield nears 80% in push to rival SK Hynix

Samsung Electronics' production yield for its sixth-generation high-bandwidth memory, HBM4, has reportedly approached 80%, marking a...

Wednesday 12 August 2026
Apple's shadow looms over TSMC's Sony sensor deal

TSMC's board formalized its image-sensor tie-up with Sony on Tuesday as part of a broader capacity mandate that underscores how much...

Wednesday 12 August 2026
Synnex sees strong growth in value-added commercial IT, semiconductors
AI-driven enterprise procurement and a consumer shift toward higher-end products lifted Synnex Technology International's revenue and profit in the second quarter of 2026, with profit...
Wednesday 12 August 2026
TSMC-Sony's US$4.69B sensor venture is a defensive play against Samsung and China

TSMC and Sony Group are betting that closer integration, not just closer proximity, is what it will take to keep their combined lead...

Wednesday 12 August 2026
Tsang Yow's semiconductor parts business drives profit growth in 2Q

Tsang Yow said its semiconductor equipment components business had become a major growth driver in July, as the Taiwan transmission-system...

Wednesday 12 August 2026
OCP APAC 2026: TSMC tackles CoWoS material risks while cutting 3DIC development cycle to one year
AI computing demand is rapidly increasing the complexity of chip integration, shifting advanced packaging competition beyond individual component performance to reliability and validation...
Wednesday 12 August 2026
Panel makers turn to AI packaging as old fabs gain value
Taiwanese panel makers broadly reported weaker July revenue as some customers pulled in shipments in advance in the first half of the year and memory price increases weighed on consumer...