Chip on film (COF) packaging substrate supplier JMC Electronics and COF back-end service firms Chipbond Technology and ChipMOS Technologies are set to enjoy brisk sales in the second...
The most important evolution in the LCD driver IC packaging sector in 2018 is that the COF (chip on film) package process has become a crucial alternative to COG (chip on glass) for...
Chip-on-film (COF) packaging demand will start to grow substantially in the second half of 2018, driven by the arrival of new smartphones featuring an edge-to-edge display, according...
LCD driver IC backend specialist Chipbond Technology saw its net profits increase 13.1% to a three-year high of NT$2.25 billion (US$76.9 million) in 2017. EPS for the year reached...
The massive build-ups of OLED panel production capacity by China-based panel makers are expected to bring business opportunities for Taiwan-based makers, including driver IC designers,...
While expecting to benefit from increasing demand for IC solutions from the IoT, AI and 5G sectors in 2018, Taiwan-based IC testing and packaging service providers are also expected...
With COF (chip on film) package technology increasingly emerging as a mainstream packaging method for driver ICs for smartphone-use LCD and OLED panels, Taiwan players in the IC packaging...
With China's LCD panel industry emerging as a major supply source worldwide and demand for panels among China brand vendors of ICT products expanding significantly, Taiwan-based LCD...
Taiwan-based LCD driver IC packaging and testing service provider Chipbond Technology's latest strategic investment deployments in China are mainly designed to consolidate its market...
LCD driver IC packaging and testing service provider Chipbond Technology will sell a 53.69% stake in Chipmore Technology, its subsidiary based in Suzhou, to a group of investors consisting...
LCD driver IC backend specialist Chipbond Technology saw its net profits increase 37.7% sequentially to NT$702 million (US$23.3 million) in the third quarter. Net profits for the...
Chipbond Technology's consolidated revenues climbed to a record high of about NT$5 billion (US$165.3 million) in the third quarter of 2017. Market watchers expect the company to post...
A ramp-up of orders for communications chips, as well as TV panel-use driver ICs and TDDI (touch with display driver) chips, will enable Taiwan-based IC backend firms to enjoy a particularly...
Chipbond Technology, a backend house specializing in LCD driver ICs, is expected to see its third-quarter revenues climb to an all-time high, according to market watchers.
Backend houses Chipbond Technology and ChipMOS Technologies have seen orders for TDDI (touch with display driver integration) chips for use in 18:9 smartphone panels ramp up, which...
