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NEWS TAGGED CHENGDU
Friday 18 August 2023
Advanced packaging becomes next battlefield for Intel and TSMC
The importance of advanced packaging to the continuation of Moore's Law has already attracted TSMC and Intel to the field.
Tuesday 25 July 2023
GF Chengdu tells the tale of abandoned semiconductor projects in China
After being suspended for nearly 5 years and with more than US$10 billion of investment engaged, GF's 300 mm (12-inch) wafer foundry in Chengdu, China, is said soon to be taken over...
Monday 24 July 2023
Shanghai HLMC is said to takeover GF's Chengdu Foundry
At a time when China is in urgent need of increasing its semiconductor capacity, Chinese media outlet Ijiwei has recently disclosed that Shanghai Huali Microelectronics (HLMC),...
Tuesday 14 February 2023
Tsinghua Unigroup rumored to take over GlobalFoundries' wafer fab in Chengdu, China
Industry rumors stated that Tsinghua Unigroup could be taking over GlobalFoundries (GF)'s 12-inch wafer fab in Chengdu, China. In exchange, the Chengdu city government will be investing...
Friday 16 December 2022
Chengdu Silan raises CNY500 million to fund automotive IC packaging biz
Chengdu Silan Semiconductor Manufacturing, a subsidiary of discrete component IDM Silan Microelectronics, has raised CNY500 million (US$71.7 million) from two new Chinese investors...
Wednesday 31 August 2022
COVID resurgence in Sichuan to have little impact on notebook production
A resurgence of coronavirus outbreaks in Chongqing and Chengdu in China's Sichuan province is unlikely to have a substantial impact on the overall local notebook output, due to the...
Thursday 28 April 2022
Notebook ODMs scaling down output in China due to component shortage
A worsening shortage of notebook components due to Kunshan's COVID lockdown extension is prompting ODMs to scale down their output mainly in Chongqing and Chengdu by 40-50%, according...
Wednesday 20 April 2022
Notebook and iPad production in western China impacted by eastern city lockdowns
Notebook production in Chongqing and manufacturing of iPads in Chengdu in western China are both witnessing inventory depletion for some components because of lockdowns in Shanghai...
Tuesday 9 March 2021
Touch panel maker GIS to expand capacity for IT applications
Touch panel maker General Interface Solution (GIS) plans to invest an additional NT$3.404 billion to expand its backend module capacity for IT products at its factory site in Chengdu,...
Friday 25 September 2020
BOE to acquire majority stakes in CEC-Panda LCD fabs
BOE Technology has reached a deal to acquire majority stakes in two advanced LCD fabs owned by CEC-Panda LCD Technology in Nanjing and Chengdu respectively for a total of CNY12.117...
Thursday 23 July 2020
CEC-Panda LCD fabs reportedly up for sale
China's Nanjing Huadong Electronics Information and Technology has disclosed that it is looking for potential buyers of its stakes in two LCD fabs belonging to its subsidiary CEC-Panda...
Monday 17 February 2020
Notebook ODMs running out of components
Taiwanese notebook ODMs have already resumed assembly operations in China, but risks of supply chain disruptions in March are mounting, as inventories of many components will run...
Tuesday 11 February 2020
Notebook ODMs worry about insufficient components supply amid outbreak
Many large-size downstream assemblers have gradually resumed production in China, but they are worried that insufficient components support may disrupt production starting in March...
Wednesday 5 February 2020
Notebook ODMs to see coronavirus hit production
Taiwan-based notebook ODMs, which operate their plants mainly in China, have estimated their production utilization rates will range from 50% to 70% after resuming operation following...
Thursday 29 August 2019
Tsinghua Unigroup to set up DRAM operations HQ in Chongqing
China's state-owned Tsinghua Unigroup has clinched a deal with the Chongqing municipal government to build its DRAM operations headquarters, R&D and manufacturing facilities in...
Dec 8, 10:41
ASUS Handheld Ultrasound LU700 series: lightweight, high resolution and long battery life solution for mobile healthcare
Friday 8 December 2023
Clientron garners the prestigious 2024 Taiwan Excellence Award for innovative Smart eCockpit of Electric Vehicle
Wednesday 6 December 2023
AIRA features CPU-powered face recognition to address market challenges
Tuesday 5 December 2023
PowerArena uncovers human factors causing production line bottlenecks, boosting productivity and quality
TSMC likely to win it all, with Samsung's 3nm reportedly losing several significant orders
Approximately 1,400 ASML equipment installed in China, limited application for advanced chip expected
Huawei's 5nm chip in L540 NB could be inventory made by TSMC before US ban
Global semiconductor market to rebound with 13% growth in 2024, says WSTS
Samsung and SK Hynix will both supply HBM3 for AWS Trainium 2
Huawei's NearLink wireless technology signals a decoupled connected world
Intel cuts off manufacturing in IDM2.0, TSMC is expected to benefit
Tesla's humanoid robot 'Optimus' debuts in Taiwan, showcasing AI advancements
ASML reportedly sees first big EUV equipment order cut from TSMC
US, Japanese, and Dutch semiconductor equipment export values to China dropped; more substantial strategies demanded by expert
Global top-5 notebook brands experience over 20% on-month shipment drop in October, says DIGITIMES Research
Global notebook shipments rise in 3Q23 but to slip in 4Q23, says DIGITIMES Research
Research Insight: order backlog, China demand to drive Infineon automotive segment in FY24
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