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Wednesday 10 November 2021
TSMC, Sony to form JV foundry in Japan
TSMC and Sony Semiconductor Solutions (SSS) have jointly announced plans to establish a joint-venture foundry in Kumamoto, Japan to initially provide 22nm and 28nm process manufacturing...
Thursday 21 October 2021
ASML gearing up for EUV equipment boom
With Intel announcing plans to adopt ASML's high-NA EUV machines in its post-nanometer process technology that is expected to be ready for production by 2025, ASML has disclosed it...
Friday 15 October 2021
Will foundry expansions lead to capacity glut?
Many IDMs and pure-play foundries, including second-tier ones, are all poised to expand their fab capacities sparking concerns that the arrival of the additional capacities could...
Friday 15 October 2021
TSMC sees fab capacity stay tight, mulls new fab in Japan
TSMC will see its 12- and 8-inch fab capacities stay tight in 2021 and throughout 2022, and is gearing up for its next stage of growth, said company CEO CC Wei at an earnings earnings...
Thursday 14 October 2021
TSMC expects 4.5% revenue growth in 4Q21
TSMC expects to post revenues of between US$15.4 billion and US$15.7 billion in the fourth quarter of 2021, which is a 4.5% sequential increase at the midpoint. Gross margin and operating...
Tuesday 12 October 2021
Nanya expects bit sales to contract in 4Q21
DRAM maker Nanya Technology expects its bit sales to contract in the fourth quarter of 2021, with chip ASPs likely to fall through the first quarter of next year, according to company...
Wednesday 6 October 2021
TSMC to expand 7nm and 28nm fab capacities
TSMC is poised to comprehensively expand production capacities for both its 7nm and 28nm process technologies, in addition to its planned 5nm process expansion, which may prompt the...
Friday 24 September 2021
DDI backend firms to enhance advanced testing capacity
Display driver IC backend specialists Chipbond Technology and ChipMOS Technologies are looking to enhance their high-end testing capability, eyeing promising growth in demand for...
Tuesday 31 August 2021
Zhen Ding expects profit growth in 2H21
Zhen Ding Technology is poised to post profit growth in the second half of 2021, thanks to a ramp-up in orders for AI, IoT and automotive device applications, according to the PCB...
Friday 13 August 2021
Nan Ya PCB upbeat about 2H21 sales
Taiwan's IC substrate maker Na Ya PCB expects its second-half 2020 revenues to grow significantly on volume shipments for new applications in the peak season, but is also concerned...
Tuesday 10 August 2021
Silicon wafer suppliers expanding capacity slowly
Capacity expansions at silicon wafer suppliers are proceeding at a pace that may not be able to keep up with foundries' aggressive capacity expansion plans, according to market sou...
Friday 30 July 2021
IC backend sector to see new supply-demand balance in 2023, says ASE Technology
ASE Technology expects the IC backend sector not to reach a new balance between supply and demand until 2023 at the earliest, and it has landed some long-term orders set for fulfillment...
Thursday 29 July 2021
Unimicron sees ABF substrate capacity fully booked through 2025
Unimicron Technology expects to sustain full capacity utilization for ABF substrates through 2025 as its capacity has been almost fully booked till then, according to the Taiwan-based...
Wednesday 28 July 2021
PTI raises capex outlook for 2021
Logic and memory IC backend house Powertech Technology (PTI) has revised upward its capex target this year to NT$17 billion (US$606.05 million) from the NT$15 billion estimated pre...
Monday 19 July 2021
FCCL maker Taiflex expects slight revenue growth in 2021
Taiwan-based FCCL specialist Taiflex Scientific has reiterated its revenue outlook this year of a slight increase compared to 2020.