AMD has a close and solid relationship with TSMC on the 3nm technology, and the two companies are already working on several new product developments, according to Lisa Su, chairperson...

Nvidia is reportedly planning to adopt Fan-Out Panel Level Packaging (FOPLP) technology for its GB200 AI server chips ahead of schedule, aimed at addressing the tight production capacity...

Key Takeaway: Fabs located in China have been purchasing equipment at a rapid pace during the past three years leading to expanding capacity.

As Chinese display industries dominate the LCD industry, they are now capable of controlling not only the availability but also prices, meanwhile affecting the capabilities of supply...

Semiconductor probe card supplier MJC Probe (MPI) has fully utilized its production capacity, anticipating a stronger second half than the first half.

As daily life and industrial development rely more and more on electricity, the global demand for the construction and updating of power infrastructure has also increased significa...

Optical film packaging and CMOS image sensor (CIS) back-end manufacturer VisEra held its shareholder meeting and board of directors election on May 22.

China-based CCL maker Kingboard Laminates has notified customers of immediate price hikes to reflect growing raw materials costs, according to industry sources.

The installed capacity of wafer fabrication will exceed 40 million wafers per quarter (in 300mm wafer equivalent), increasing by 1.2% in the first quarter of 2024 and an anticipated...

Semiconductor Manufacturing International Corporation (SMIC) recently reported a robust momentum with a year-on-year revenue growth of about 20% in the first quarter of 2024, but...

Topco Scientific, a Taiwan-based semiconductor material distributor, has seen a significant increase in orders from Chinese foundries whose 12-inch fab utilization rates have risen...

Polar Semiconductor, the only US-based manufacturer specializing in sensor, power, and high-voltage semiconductors, disclosed plans to expand its Bloomington, Minnesota manufacturing...

The US will triple its domestic semiconductor manufacturing capacity from 2022—when the CHIPS and Science Act (CHIPS) was enacted—to 2032. The projected 203% growth is...

Peter Chen, Chairperson of Qisda, stated that the company has passed the lowest ebb of operation in 2024, with growth expected to occur quarter by quarter.

TSMC has already seen utilization rates for its 3nm family climb to more than 95%, and with strong demand from customers, including Apple, for its N3E process, capacity supply at...