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Thursday 9 April 2020
TSMC sees CoWoS packaging capacity utilization ramp up
TSMC has seen utilization of its chip-on-wafer-on-substrate (CoWoS) packaging capacity rise substantially in the second quarter of 2020, and now runs the packaging production lines...
Tuesday 24 March 2020
Backend firms see stable demand for TV, STB, gaming, server chips
Backend service firms have seen stable orders for processing chips for TVs, set-top boxes (STB), game consoles, cloud servers, and IP network cameras, while demand for packaging smartphone...
Thursday 12 March 2020
Micron samples uMCP with LPDDR5
Micron Technology has begun sampling what the company claims is the industry's first universal flash storage (UFS) multichip package (uMCP) with low-power DDR5 (LPDDR5) DRAM. The...
Friday 7 February 2020
Micron delivers LPDDR5 for high-performance smartphones
Micron Technology has announced mass production of what the company claims is the world's first low-power DDR5 DRAM that will be used in the soon-to-be-released Xiaomi Mi 10 smartp...
Friday 7 February 2020
DSS to be used for enterprise applications for 5G in 2H20, says Digitimes Research
To improve 5G spectrum's usage efficiency, 3GPP has brought up several solutions with dynamic spectrum sharing (DSS) being one of the major technologies expected to be used when transitioning...
Monday 3 February 2020
Taiwan 4Q19 international Internet bandwidth over 3,565Gbps
Taiwan's direct Internet connection with 12 countries/cities reached total bandwidth of 3,565.368Gbps as of the end of fourth-quarter 2019, increasing 4.84% sequentially and 28.61%...
Thursday 30 January 2020
Sales of semiconductors performing AI functions set to triple by 2025, says IHS
The global market for memory and processing semiconductors used in artificial intelligence (AI) applications will soar to US$128.9 billion in 2025, three times the US$42.8 billion...
Thursday 9 January 2020
Micron starts sampling 1znm DDR5
Micron Technology has begun sampling DDR5 Registered DIMMs (RDIMM) based on its 1znm process technology, according to the company.
Monday 23 December 2019
Etron partners with Lattice Semicon to develop AI+DRAM solutions
Memory design house Etron Technology has teamed up with US-based FGPA chipmaker Lattice Semiconductor on developing new miniaturized AI+DRAM platform for applications to terminal...
Thursday 19 December 2019
Baidu, Samsung team up for AI chips
Baidu and Samsung Electronics have announced jointly that Baidu's first cloud-to-edge AI accelerator, Baidu Kunlun, has completed its development and will be mass-produced early next...
Tuesday 26 November 2019
Loading, bandwidth capacities matter for 5G networks, says Samsung executive
When planning the rollouts of their 5G networks, Taiwan's telecom operators should not focus on factors such as the extended cost for network coverage, but rather on whether the loading...
Friday 15 November 2019
Micron intros 1TB microSD card for cloud-managed video surveillance
Micron Technology has unveiled what the company claims is the world's highest-capacity industrial microSD card, the Micron i300 microSDXC UHS-I series, which is offered in 128GB to...
Wednesday 23 October 2019
Taiwan 3Q19 international Internet bandwidth over 3,400Gbps
Taiwan's direct Internet connection with 12 countries/areas reached total bandwidth of 3,400.868Gbps as of the end of third-quarter 2019, increasing 2.28% sequentially and 44.56%...
Monday 7 October 2019
Optical communication sector to rebound on 5G-driven fiber upgrades
The optical communication equipment industry is expected to resume growth momentum in 2020 after three years of lackluster demand, as new 5G infrastructure construction projects kicking...
Friday 23 August 2019
Xilinx intros FPGA featuring 9 million system logic cells
Xilinx has announced the expansion of its 16nm Virtex UltraScale+ family to now include what the company claims is the world's largest FPGA, the Virtex UltraScale+ VU19P, with 35...