The shortage of automotive chips has not been completely resolved and is likely to persist through 2026 or even 2030, according to McKinsey & Company and the Boston Consulting...
Successfully averting the crisis of automotive chip shortages, Hyundai Motor Group leapt to the world's 3rd-largest automaker by sales volume in the first half of 2022, up from 5th...
Automotive chips and power devices continue to see uneven supplies, and Taiwan's leading OSATs including ASE Technology and international IDMs such as Infineon, Renesas, NXP, ST Microelectronics...
The supply of automotive microcontroller units (MCU) and power insulated-gate bipolar transistors (IGBT) is expected to remain short in 2023, according to sources in the car industry...
MediaTek is lagging behind Qualcomm in the automotive electronics field, with the latter already obtaining orders from multiple car vendors, according to market sources.
Taiwan-based OSATs including ASE Technology, Powertech Technology Group (PTI), King Yuan Electronics (KYEC), Ardentec, Sigurd Microelectronics are all looking to grow revenues from...
Backend demand for automotive MCUs and MPUs remains in high gear, with OSATs and packaging materials suppliers seeing clear order visibility through the end of this year, according...
Despite a rapid slowdown in mass-market chip demand, automotive chip demand remains robust with suppliers vying for more available fab capacity in the fourth quarter of 2022, according...
After walking out of the impact of the pandemic on production, car makers in India still have to face lingering chip shortages, which may hurt the demand in the upcoming festive se...
Although over-supply has become an issue for the semiconductor industry, automobile chip shortage still lingers, impacting India's largest passenger vehicle vendor's ability to meet...
Deceleration in pull-ins of orders for HPC and handset chips has significantly shortened delivery lead times at IDMs, according to industry sources in China. However, the available...
SEMI, Foxconn Technology and UMC have jointly released the SEMI Auto IC Master program designed to provide complete automotive chip solutions through effective and close partnerships...
High heat dissipation and other thermal management technologies are increasingly required for both front- and back-end chipmaking processes by companies engaged in the automotive,...
As handsets and consumer devices will continue to see sluggish sales prospects, automotive chip vendors hope foundry partners can again allocate more capacity for still-scant automotive...
