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Wednesday 25 May 2022
Global top-3 DRAM makers hold 94% of 2021 market
Samsung Electronics, SK Hynix and Micron Technology held a combined 94% share of the global DRAM market in 2021, with Samsung and SK Hynix collectively taking up 71.3% of the market,...
Monday 9 May 2022
Memory chips increasingly important in heterogeneous integration, says Winbond
The role of memory chips has become increasingly important in heterogeneous integration, and Winbond Electronics is working with potential customers in multiple related design projects,...
Friday 1 April 2022
Global smartphone application processor market grows 23% in 2021 revenue
The global smartphone application processor (AP) market grew 23% to US$30.8 billion in 2021, according to Strategy Analytics. Qualcomm maintained its smartphone AP leadership with...
Friday 11 March 2022
Ayar Labs announces additional traction for silicon photonics
Ayar Labs has announced it is partnering with Lumentum, the largest manufacturer of optical and photonics products, to deliver CW-WDM MSA compliant external laser sources in high...
Tuesday 8 March 2022
GF announces next-gen silicon photonics solutions
GlobalFoundries' next-generation silicon photonics platform, GF Fotonix, is available now to address the explosive growth of soaring data volumes while significantly reducing power...
Friday 4 March 2022
Intel, other industry leaders set up UCIe consortium
Intel has announced it is among industry titans working to advance the future of semiconductor architectural innovations with new UCIe standard.
Wednesday 19 January 2022
Samsung intros Exynos 2200 processor with RDNA 2 Xclipse GPU
Samsung Electronics has announced its new premium mobile processor, the Exynos 2200, which is equipped with a powerful Samsung Xclipse graphics processing unit (GPU) based on AMD...
Wednesday 12 January 2022
Global fab equipment spending to log record high in 2022, says SEMI
Global fab equipment spending for front-end facilities is expected to rise 10% on year to a new all-time high of over US$98 billion in 2022, marking a third consecutive year of growth,...
Thursday 6 January 2022
CES 2022: Intel achieves major milestones across automotive, PCs, graphics
As part of CES 2022, Intel demonstrated advancements and momentum with Mobileye, progress toward discrete graphics leadership and the launch of the newest members of the 12th Gen...
Friday 24 December 2021
Stellantis expands software R&D in India
Stellantis' innovation centers in India are expected to double the workforce and become the carmaker's global base for software. The carmaker is also deepening its partnership with...
Wednesday 22 December 2021
Micron sees AI, 5G and EV drive memory demand growth
Memory and storage revenue has outpaced the rest of the semiconductor industry over the last two decades, according to Sanjay Mehrotra, president and CEO for Micron Technology, who...
Monday 20 December 2021
Gogoro leverages AI solution to rapidly expand to India, Indonesia and China
After announcing partnerships in 2021 with Hero Moto in India and Gojek in Indonesia, the electric motorcycle and battery swap company Gogoro aims to start producing electrical motorbikes...
Wednesday 15 December 2021
SK Hynix starts shipping 24Gb DDR5 chip samples
SK Hynix has started shipping samples of 24Gb DDR5 chips, according to the company.
Thursday 25 November 2021
Samsung to set up advanced wafer fab in Texas
Samsung Electronics has announced plans to invest an estimated US$17 billion in the establishment of a new semiconductor manufacturing facility in Taylor, Texas. The fab will be dedicated...
Friday 19 November 2021
Textile industry goes digital
The fashion industry is moving toward a more digitalized future, one that promotes improved efficiency and sustainability. This was the focus of the first day of the 2021 World Digital...
Wednesday 26 May 2021
Samsung HKMG DDR5
Samsung Electronics has expanded its DDR5 DRAM memory portfolio with a 512GB DDR5 module based on high-K metal gate (HKMG) process technology. Delivering more than twice the performance of DDR4 at up to 7,200Mbps, the new DDR5 will be capable of orchestrating the most extreme compute-hungry, high-bandwidth workloads in supercomputing, artificial intelligence (AI) and machine learning (ML), as well as data analytics applications. Samsung indicated the new DDR5 utilizes highly advanced HKMG technology that has been traditionally used in logic semiconductors. With continued scaling down of DRAM structures, the insulation layer has thinned, leading to a higher leakage current. By replacing the insulator with HKMG material, Samsung's DDR5 will be able to reduce the leakage and reach new heights in performance. This new memory will also use approximately 13% less power, making it especially suitable for datacenters where energy efficiency is becoming increasingly critical. Leveraging through-silicon via (TSV) technology, Samsung's DDR5 stacks eight layers of 16Gb DRAM chips to offer the largest capacity of 512GB. TSV was first utilized in DRAM in 2014 when Samsung introduced server modules with capacities up to 256GB.
Friday 9 August 2019
Intel 10th Gen Core processor
Intel has launched 11 highly integrated 10th Gen Intel Core processors, manufactured via Intel's 10nm process and designed for 2-in-1s and notebooks. The processors bring high-performance artificial intelligence (AI) to the PC at scale, feature new Intel Iris Plus graphics and Intel Wi-Fi 6 (Gig+) and Thunderbolt 3. Systems are expected from PC manufacturers for the holiday season. In addition to performance and responsiveness gains, AI, graphics, connectivity and I/O are optimized on the SoC for a solution that delivers a feature-rich suite of capabilities for OEMs to create notebooks.
AROUND THE WEB
CES 2022: Intel achieves major milestones across automotive, PCs and graphics
Tuesday 4 January 2022
May 27, 10:24
Empower manufacturing with AI: Into new era of smart manufacturing with collective wisdom
Tuesday 24 May 2022
MSI unveils new lineup at Computex 2022 Online
Thursday 19 May 2022
STAr Technologies unveils one-touch memory test probe card
Thursday 19 May 2022
Computex Focus: DataVan to showcase new retail solutions for new normal
Renesas to reopen Kofu factory as 300mm wafer fab dedicated for power semiconductors
IC design houses bracing for cutback in orders from China handset brands
TSMC to move CoWoS-L technology to commercial production in 2 years
Intel makes key investments to advance datacenter sustainability
Concerns rising over potential foundry overcapacity in 2024
Apple car team reportedly in talks with Korean and Japanese suppliers
AMD, MediaTek reportedly in talks to form JV
TSMC to raise quotes for advanced, mature process technologies by 10-20%
BYD Semiconductor takes major stake in Energen
Is GF a good buy for Intel?
EV penetration to rise to 30% in 2025, says DIGITIMES Research
Non-foundry IC segments gaining weight in HPC era, says DIGITIMES Research
DIGITIMES Research worldwide notebook shipment update – February 2022
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