中文網
繁體
简体
SUBSCRIBE
My account
Sign in
Sign up
TECH
Tech Home
Semiconductors
Communications
ICT
Displays
Electric Vehicles
Sustainability
Aerospace
REGIONS
Asia Home
East Asia
Southeast Asia
South Asia
AsiaTech Frontier
RESEARCH
OPINIONS
Opinions Home
Interviews
Colley & Friends
Commentary
Research Insights
Column
FINANCE
BIZ FOCUS
Biz Focus Home
Trending Issues
COMPUTEX
SEMICON
CES
EVENT+
Event+ home
Featured Events
MULTIMEDIA
SUBSCRIBE
Trending
Intel
Nvidia
Meet the Analysts
Server EMS Tracker
Robotics Report
AI Server Report
SCMP Bundle
Trending
SUBSCRIBE
CONNECT WITH US
REALTIME NEWS
AI infrastructure investment may enter adjustment phase in 2026, with small-and medium-sized business demand driving new momentum
Semiconductors
2min ago
FOPLP progress fastest in foundries, slower in testing and panel fabs
Tomorrow's Headlines
Sep 9, 18:37
YMTC launched third phase with hubei state capital support, no big fund stake
Tomorrow's Headlines
Sep 9, 18:37
Military and semiconductor sectors boost IPC growth momentum
Tomorrow's Headlines
Sep 9, 18:36
AI chip demand drives future semiconductor growth trends
Tomorrow's Headlines
Sep 9, 18:36
YMTC decade-long journey highlights the evolution of China tech sovereignty
Tomorrow's Headlines
Sep 9, 18:36
China's leading wafer maker aquaire three loss-making subsidiaries to strengthen 12-inch wafer integration
Tomorrow's Headlines
Sep 9, 18:36
NEWS TAGGED ANALOG IC
Monday 26 May 2008
UTAC sees good order visibility
United Test and Assembly Center (UTAC) CEO JC Lee is bullish about the performance of mixed-signal and analog ICs, as order visibility for these products at UTAC has extended through...
19/19
pages
1
...
16
17
18
19
BIZ FOCUS
Aug 5, 11:49
Cultivating OCP, embracing open source
Wednesday 3 September 2025
Tescan Unveils New Global Brand Platform 'The Art of Discovery' with APAC Rollout at SEMICON Taiwan
Wednesday 3 September 2025
Micraft System Plus Unveils Proprietary Thermo-Compression Bonder, Expands into Advanced Packaging Market
Wednesday 3 September 2025
SK hynix Introduces Industry's First Commercial High NA EUV
MOST-READ
7 DAYS NEWS
Samsung-Nvidia CEO embrace hints at HBM4 deal amid Seoul's U$150B US pledge
TSMC to raise foundry prices by 5-10% across advanced nodes in 2026
Inside TSMC's 2nm leak involving TEL: How a job application became an international incident
CoWoP packaging takes on TSMC’s CoWoS, pressures CoPoS in AI chips
China's YMTC moves into DRAM, teams with CXMT to target HBM market
Apple launches iPhone 17 Pro, Pro Max and thinnest-ever Air with new A19 Pro chip
China AI surge with 5,000 firms and 788 EFLOPS capacity, yet supply-demand mismatch persists
NXP taps former TI China chief to steer Greater China amid rising competition
Advanced packaging battle intensifies as foundry, OSAT, and PCB sectors enter tripartite era
Switzerland launches open-source AI model Apertus developed by top research institutes
Full list
Members only
×
Sorry, the page you are trying to open is available only for our paid subscribers.
Please
login
to read more
New users, please
register
first