CONNECT WITH US
NEWS TAGGED TESTING
Thursday 20 November 2025
Nvidia partners with Amkor, SPIL, and Menlo Micro to boost US IC backend capacity
Nvidia has announced key partnerships to expand its supply chain and manufacturing capacity in the US, aiming to meet rising global demand for artificial intelligence (AI) computing...
Thursday 20 November 2025
Amkor invests US$177M to expand AI chip packaging in South Korea
Amkor, one of the largest US-based outsourced semiconductor assembly and test (OSAT) providers, has begun investing over KRW260 billion (approx. US$177 million) in South Korea to...
Thursday 20 November 2025
Malaysia emphasizes regional trade, AI and strong international ties to boost semiconductor and E&E industries
Malaysian Prime Minister Anwar Ibrahim stressed that strengthening ASEAN trade and investment, while focusing on digital technology and AI, is essential for national success. He highlighted...
Thursday 20 November 2025
Taiwan's precision components drive humanoid robot development
Hon Hai (Foxconn) is set to unveil its humanoid robot, developed in collaboration with Taiwanese suppliers, at its Hon Hai Technology Day (HHTD) event scheduled for November 21–22,...
Wednesday 19 November 2025
Global semiconductor IDM investment in ASEAN

Introduction

Tuesday 18 November 2025
Panjit acquires Torex Vietnam to boost global packaging and testing capacity
Panjit International has approved the use of US$10.03 million of internal funds to acquire a 95% stake in Torex Vietnam Semiconductor (Torex Vietnam), a subsidiary of Torex Semiconductor,...
Tuesday 18 November 2025
Panjit's MOSFET becomes top 3Q25 revenue contributor
Power semiconductor integrated device manufacturer (IDM) Panjit International has announced its consolidated financial results for the third quarter of 2025. Although quarterly revenue...
Saturday 15 November 2025
Taiwan's AutoSys turns self-driving Algorithms into next-gen AI exports

As one of the most demanding testing grounds for AI, autonomous driving technology has become a high-security laboratory where next-generation...

Friday 14 November 2025
AI chip test interface demand surges; Taiwan orders visible through 2026
As AI ASIC makers accelerate the release of next-gen chips to catch up with AI GPU leaders, industry observers expect a major shift in the AI chip landscape by 2026. This transformation...
Friday 14 November 2025
DDR5 becomes 2026 standard, and power-control overhaul lifts passive component market
The memory market's ongoing shortage-and-price surge continues to accelerate, lifting the broader sector and boosting earnings for DRAM manufacturers, module suppliers, memory packaging...
Thursday 13 November 2025
Tanaka develops rhodium probe pin material for semiconductor testing
Tanaka Precious Metal Technologies has developed TK-SR, a rhodium-based material for probe pins used in probe cards during semiconductor front-end testing.
Thursday 13 November 2025
Fonontech - Discover the impact of Impulse Printing for fast 3D interconnects

Fonontech B.V. is a device solution provider and startup company based on Impulse Printing technology. Impulse printing technology can be described as a novel additive...

Tuesday 11 November 2025
G-Tech Optoelectronics develops aerospace-grade glass conformal antenna with US defense partner
G-Tech Optoelectronics (GTOC), a glass processing subsidiary of Foxconn, has announced a joint development project with a US-based partner for an aerospace-grade glass conformal antenna...
Wednesday 5 November 2025
KYEC secures triple AI chip testing contracts, expands production in Taiwan and Singapore
The global race to build next-generation AI computing power is accelerating, and Taiwan’s King Yuan Electronics Corp. (KYEC) has emerged as a key winner.
Monday 3 November 2025
Nexperia China accuses Dutch parent of US$140 million debt
The Chinese arm of Dutch semiconductor maker Nexperia has publicly accused its headquarters of owing more than CNY1 billion (approximately US$140 million) in unpaid fees, escalating...