Sun, Jan 23, 2022
Before going to press
7 days news
Chips + Components
Displays + Photonics
EV + Green Energy
IT + CE
Mobile + Telecom
Asia Supply Chain 100
Asia Supply Chain 100
South/Southeast Asian ranking
Internet, Cloud, AI
Accelerators & incubators
Research on demand
Products & services
China smartphone AP
Special Report Databases
Commentary and analysis
Biz Focus home
CONNECT WITH US
NEWS TAGGED 4GB
Thursday 6 January 2022
Specialty DRAM prices soon to stop falling
DDR3 and other specialty DRAM prices are expected to stop falling and begin to rise as early as between the end of the first quarter and the second quarter, according to industry...
Monday 15 November 2021
Taiwan DRAM firms to see gross margin drop in 4Q21
With DRAM memory prices starting to fall in the fourth quarter of 2021, Taiwan-based chipmakers and module houses are poised to see their gross margins decline during the quarter,...
Thursday 11 November 2021
Macronix developing 3D NOR flash
Macronix International is engaged in the development of 3D NOR flash memory in-house, which is expected to bear fruit within two years, according to company chairman Miin Wu.
Tuesday 2 November 2021
Specialty memory maker ESMT upbeat about ASP growth in 2022
Specialty memory IC design house Elite Semiconductor Memory Technology (ESMT) expects its gross margin to stay high at above 40% in the fourth quarter of 2021, with the prospect that...
Friday 3 September 2021
DDR3 contract prices likely to drop in 4Q21
DDR3 contract prices for the fourth quarter will be under downward pressure, as spot prices have been falling recently, according to industry sources.
Wednesday 18 August 2021
Macronix to enhance 3D NAND, advanced NOR flash offerings
Macronix International will be strengthening its 3D NAND and advanced NOR flash offerings, eyeing a bigger presence in the automotive and other niche-market sectors, according to...
Friday 13 August 2021
Winbond to generate additional output for specialty DRAM starting 4Q22
Winbond Electronics expects to kick off production for specialty DRAM memory in small volume at its new plant in Kaohsiung, southern Taiwan in the fourth quarter of 2022, according...
Tuesday 13 July 2021
DDR3 prices to continue rally
The supply of DDR3 memory will stay tight prompting further price increases through the end of 2021, according to industry sources.
Thursday 29 April 2021
DRAM contract prices to rise 10% in May
Contract market prices for PC- and server-use DRAM memory will rise about 10% in May alone, despite a recent slowdown in the spot market price growth, according to sources at memory...
Friday 5 March 2021
DRAM, NOR flash prices to rise through 2H21
DRAM and NOR flash memory prices are expected to rise through the second half of 2021, as growth on the supply side fails to catch up, according to industry sources.
Monday 1 February 2021
DDR3 prices to rise 40-50% in 2021
DDR3 prices are expected to rise 40-50% in 2021, according to industry sources who estimated previously a slower 30% increase.
Wednesday 27 January 2021
Flex Logix pairs InferX X1 inference accelerator with high-bandwidth Winbond 4Gb LPDDR4X to set new benchmark in edge AI
Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, has revealed that its low-power, high-performance LPDDR4X DRAM technology is supporting...
Tuesday 12 March 2019
DRAM contract prices continue downward trend
DRAM memory contract prices have fallen further in March, and are expected to continue their downward trend through the second quarter indicating PC OEMs and other chip buyers continue...
Wednesday 16 January 2019
Fall in 1Q19 DRAM prices larger-than-expected, says DRAMeXchange
DRAM contract prices are set to fall nearly 20% sequentially in the first quarter of 2019, according to DRAMeXchange, which estimated previously a smaller 15% price decrease.
Tuesday 3 April 2018
DRAM supply remains tight
The average and highest contract prices of mainstream DDR4 4GB modules remained at US$33 and US$34, respectively, in March, according to DRAMeXchange. Contract prices for PC DRAM...
Friday 3 June 2016
AMD to release first Polaris graphics card soon
AMD has unveiled the company's strategy for its upcoming Polaris architecture-based Radeon RX series graphics cards, introducing levels of VR performance and future-proof technologies at a variety of price points. The Radeon RX 480 delivers premium VR capability at a price of starting at US$199 for the 4GB edition. Set for launch and availability on June 29, the Radeon RX 480 will deliver a solution for premium PC VR experiences, delivering VR capability common in US$500 GPUs. AMD expects that PC VR enabled by Polaris architecture-based graphics cards will drive a wide range of VR-ready desktops and notebooks, providing a catalyst for the expansion of the addressable market to an estimated 100 million consumers over the next 10 years.
Thursday 2 June 2016
Samsung Electronics has begun mass producing NVM Express (NVMe) PCIe solid state drive (SSD) in a single ball grid array (BGA) package for next-generation PCs and ultra-slim notebook PCs. The new BGA NVMe SSD, named PM971-NVMe, features a compact package that contains all essential SSD components including NAND flash memory, DRAM and controller. Configuring the PM971-NVMe SSD in a single BGA package was enabled by combining 16 of Samsung's 48-layer 256Gb V-NAND flash chips, one 20nm 4Gb LPDDR4 mobile DRAM chip and a high-performance Samsung controller. The new SSD is 20x16x1.5mm and weighs only about one gram. The single-package SSD's volume is approximately a 100th of a 2.5-inch SSD or HDD, and its surface area is about a fifth of an M.2 SSD. The PM971-NVMe SSD enables sequential read and write speeds of up to 1,500MB/s and 900MB/s respectively, when TurboWrite technology is used. The performance figures can be directly compared to transferring a 5GB-equivalent, Full-HD movie in about three seconds or downloading it in about six seconds. It also boasts random read and write IOPS of up to 190K and 150K respectively. The PM971-NVMe SSD line-up will be available in 512GB, 256GB and 128GB storage options. Samsung will start providing the new SSDs to its customers in June worldwide.
Wednesday 9 December 2015
Samsung 128GB TSV DDR4 RDIMM
Samsung Electronics has announced that it is mass producing what it calls the industry's first "through silicon via" (TSV) double data rate-4 (DDR4) memory in 128-gigabyte (GB) modules for enterprise servers and data centers. The 128GB TSV DDR4 RDIMM is comprised of a total of 144 DDR4 chips, arranged into 36 4GB DRAM packages, each containing four 20nm-based 8Gb chips assembled with TSV packaging technology. Samsung's 128GB TSV DDR4 RDIMM provides a low-power solution for next-generation servers with speeds at up to 2,400Mbps, while cutting power usage by 50%, compared to using the previous highest capacity DRAM modules - 64GB LRDIMMs, whose four-chip package stacks are hampered by power and speed limitations caused by their use of conventional wire bonding. Samsung added the company will continue to introduce TSV DRAM with higher performance. These will include modules with data transfer speeds of up to 2,667Mbps and 3,200Mbps that help to meet intensifying enterprise server needs, while expanding TSV applications into high bandwidth memory (HBM) and consumer products.
Jan 20, 11:47
ADLINK and AU Optronics partner up using edge visualization to perfect smart application services
Monday 17 January 2022
Jieqiao reaches MagicWick-Inside Platform license agreement with NeoGene Tech, stepping into ultra-thin and big-size vapor chamber device production
Thursday 13 January 2022
FSP launches new 2400W power supply to address bottlenecks in high-energy computing
Wednesday 12 January 2022
ADLINK releases its first SMARC module based on Qualcomm QRB5165, enabling high-performance robots and drones at low power
India's Vedanta to make 28-65nm semiconductor chips for local demand
China reports robust semiconductor industry growth despite US sanctions
TSMC to make 3nm chips for Intel at new site in northern Taiwan
PC processor prices poised to rise in 2022
Samsung wafer foundry aims to overtake TSMC by 2030
Apple car team reportedly in talks with Korean and Japanese suppliers
AMD, MediaTek reportedly in talks to form JV
TSMC to raise quotes for advanced, mature process technologies by 10-20%
BYD Semiconductor takes major stake in Energen
Is GF a good buy for Intel?
US pushing O-RAN equipment to replace China-made ones; but influence in O-RAN from China remains strong, says Digitimes Research
Digitimes Research worldwide notebook shipment update – November 2021
Taiwan PC monitor shipments grow 4.6% in 3Q21, says Digitimes Research
Sorry, the page you are trying to open is available only for our paid subscribers.
to read more
New users, please