中文網
繁體
简体
SUBSCRIBE
My account
Sign in
Sign up
TECH
Tech Home
Semiconductors
Communications
ICT
Displays
Electric Vehicles
Sustainability
Aerospace
REGIONS
Asia Home
East Asia
Southeast Asia
South Asia
AsiaTech Frontier
RESEARCH
OPINIONS
Opinions Home
Interviews
Colley & Friends
Commentary
Research Insights
Column
FINANCE
BIZ FOCUS
Biz Focus Home
Trending Issues
COMPUTEX
SEMICON
CES
EVENT+
Event+ home
Featured Events
MULTIMEDIA
SUBSCRIBE
Trending
EMS Watch
Tariffs
Meet the Analysts
HotSpot
On-Demand Briefing
AI Server Report
SCMP Bundle
Trending
SUBSCRIBE
CONNECT WITH US
REALTIME NEWS
Looming US chip tariffs spark end product demand concerns
Semiconductors
15min ago
Advantech highlights edge AI, software strategy to navigate FX fluctuations
ICT
22min ago
OpenAI walks back for-profit plan, nonprofit to keep control
ICT
27min ago
Jabil reportedly to expand AirPods enclosure production with new Indian facility amid Apple relocation
ICT
31min ago
OpenAI reaches agreement to buy startup windsurf for US$3 billion
ICT
42min ago
NT$ shock, US tariff fears slam Taiwan's export-reliant semiconductor sector
Semiconductors
46min ago
Chinese CIS vendors close gap as local fabs go full throttle, Xiaomi backs innovation
Semiconductors
51min ago
Global defense spending rise boosts Taiwan suppliers
Tomorrow's Headlines
May 5, 19:10
Taiwan's strategic navigation through the global rare earth competition
Tomorrow's Headlines
May 5, 19:10
NEWS TAGGED 3Q10
Thursday 12 November 2009
Intel to launch three Arrandale CPUs for ultra-thin notebooks in 1H10
Intel plans to launch three 32nm dual-core Arrandale CPUs (Calpella platform), the Core i7-640UM (1.2GHz), Core i7-620UM (1.06GHz) and Core i5-520UM (1.06GHz) with price in thousand-unit...
27/27
pages
1
...
24
25
26
27
BIZ FOCUS
May 5, 17:05
Femtum pioneers advanced laser solutions for semiconductor manufacturing, eyes expansion in Taiwan
Monday 5 May 2025
Clirio revolutionizes infrastructure management with augmented reality and 3D visualization
Monday 5 May 2025
Letenda pioneers innovation in electric bus manufacturing
Monday 5 May 2025
Pushing boundaries: Voice AI and LLMs meet edge computing
MOST-READ
7 DAYS NEWS
TSMC hikes 4nm pricing; US clients scramble under tariff pressure
Exclusive: Google considers HBM3E supplier change
AMD advances US chip strategy with TSMC, joining Nvidia in massive domestic shift
7 key things TSMC CEO CC Wei revealed about AI, US expansion, and tariff risks
Tech braces for tariff tsunami: DIGITIMES analysts break down impact across six key sectors
Taiwan dollar surges to two-year high, central bank refutes US pressure claims
Samsung DS chief rushes to Silicon Valley to secure AI memory and foundry orders
Former Samsung employee indicted in DRAM leak case aiding CXMT
From Biden's carrots to Trump's sticks: Chinese solar giants adapt to new U.S. playbook
Taiwan's industrial PC sector adapts to US tariffs with strategic localization and supply chain resilience
Full list
RESEARCH INSIGHTS
Intel signals overhaul of IDM 2.0 and foundry strategy with Lip-Bu Tan's appointment, says DIGITIMES
Members only
×
Sorry, the page you are trying to open is available only for our paid subscribers.
Please
login
to read more
New users, please
register
first