Monday 19 September 2022
MediaTek to mass produce HPC chips with CoWoS tech in 2023
MediaTek is set to mass produce its new HPC chips at TSMC in 2023 using advanced process node and CoWoS (chip on wafer on substrate) packaging technology, according to backend supply...
Monday 22 August 2022
AMD seen not to hike prices for mainstream core chips for PCs
Intel has disclosed plans to hike its CPU prices by 10-20% starting October, but AMD is not expected to follow suit amid the waning terminal market demand, according to industry so...
Monday 18 July 2022
TSMC on track to develop InFO_3D tech for mobile device chips
TSMC is on track to develop InFO_3D technology for processing mobile device chips that are going slimmer and lighter, looking to further expand its 3D Fabric lineup and serve more...
Monday 4 July 2022
ASML, TSMC shed lights on advanced solutions at CSTIC 2022
Heavyweight semiconductor players including sole EUV lithography equipment vendor ASML and top foundry TSMC have lately shed lights on latest front-end lithography and backend advanced...
Tuesday 7 June 2022
Top foundries, OSATs meet HPC boom with more advanced packaging solutions
Handset chips supply chain players share the view that their 2022 shipments for the segment will at best stay flat at 2021 levels, but HPC chip demand will continue to grow for datacenter,...
Tuesday 24 May 2022
TSMC poised to sustain lead with integrated advanced processes in next decade
While chip manufacturing technology continues to advance toward sub-5nm processes, advanced packaging also has been widely recognized as a key segment to progress drastically with...