TSMC's new 8-inch wafer fab to be built in Tainan will have its capacity mostly fulfill robust orders for automotive chips from STMicroelectronics and other dedicated chipmakers,...
Infineon, now the world's largest supplier of MOSFET chips, is ramping up production of such chips at its new 12-inch plant, inspiring more IDMs to follow suit in 2019, a move that...
Taiwan foundry houses see poor order visibility for the second quarter of 2019, as domestic and international IC design houses need more time to digest their chip inventories, according...
DRAM chipmaker Nanya Technology saw its revenues fall to a 19-month low in January 2019, while niche-market DRAM specialist Winbond Electronics' revenues increased 5% on month.
Specialty DRAM and flash memory chipmaker Winbond Electronics has said plans to build a new 12-inch wafer plant in southern Taiwan are still on track despite some near-term headwin...
Winbond Electronics, a maker of specialty DRAM and flash memory, saw its December revenues fall to a 20-month low of NT$3.69 billion (US$119.6 million).
Xiamen IC Design Public Service Platform has played a crucial role in helping China IC designers operating in the country's southeastern port city upgrade their design and innovation...
Foxconn Electronics' (Hon Hai Precision Industry) ambition in the chipmaking sector is taking shape. The Taiwan-based conglomerate reportedly has stuck a deal with China's Zhuhai...
The board of directors of United Microelectronics (UMC) has authorized a capital budget execution of NT$27.406 billion (US$889.4 million) for capacity deployment.
ASE Technology Holding, the parent company of IC packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL), plans to set up an IC testing service...
China-based pure-play foundry Semiconductor Manufacturing International (SMIC) expects to post a revenue decline of 7-9% sequentially in the fourth quarter of 2018, with gross margin...
Taiwan Semiconductor Manufacturing Company (TSMC) held a ceremony on October 31 to mark the opening of its 12-inch wafer plant in Nanjing, China. Company chairman Mark Liu and CFO...
Winbond Electronics saw shipments of chips built using 38nm process technology ramp up substantially to account for 24% of the chipmaker's total DRAM sales in the third quarter of...
Winbond Electronics will hold a groundbreaking ceremony for its new 12-inch wafer fab in southern Taiwan on October 3, according to the Kaohsiung city government.
