Nexchip Semiconductor, a Chinese mature-node IC foundry, has stepped up its deployment in the automotive IC sector with the opening of a new fab in Hefei specializing in manufacturing...
Winbond Electronics, a specialty DRAM and flash memory maker, has expressed optimism about its business and market prospects for next year, noting the resolution of the majority of...
Vanguard International Manufacturing (VIS), which runs only 8-inch wafer fabs, reportedly plans to set up a 12-inch fab in Singapore for fulfilling mainly automotive related IC ord...
Market observers view TSMC's overseas expansion strategy with skepticism, which also presents some opportunities for the pure-play foundry. Despite the fact that its wholly owned...
TSMC has announced that it will invest alongside Robert Bosch, Infineon Technologies, and NXP Semiconductors in European Semiconductor Manufacturing Company (ESMC) in Dresden, Germany...
TSMC has readied plans to build new CoWoS (Chip on Wafer on Substrate) capacity at its manufacturing complex in the Central Taiwan Science Park (CTSP) to meet a rapid surge in demand...
United Microelectronics Corp. (UMC) continues to observe customers adjusting inventory levels, albeit at a slower rate than expected, while cyclical shifts in the business climate...
Pure-play foundry United Microelectronics (UMC) expects its wafer shipments and ASPs to both register about flat sequential increases in the first quarter of 2023, with its capacity...
Samsung Electronics has seen its 12-inch wafer fab capacity utilization rise to 90% in the second quarter from 80% registered a quarter earlier, driven by stable 5/4nm process performance...
TSMC is reportedly slowing down its new fab project in Germany, due to growing doubts about whether the pure-play foundry will receive adequate EU subsidies in light of the region's...
