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NEWS TAGGED 12-INCH FAB
Wednesday 28 July 2021
Macronix to expand 12-inch fab capacity
Macronix International, a maker of memory chips, has disclosed plans to expand its 12-inch fab capacity for 3D NAND and NOR flash with an investment of NT$41.5 billion (US$1.48 bil...
Friday 16 July 2021
Is GF a good buy for Intel?
Intel is reportedly eyeing Globalfoundries for acquisition valued at an estimated US$30 billion. Will the acquisition be a good buy and follow Intel's IDM 2.0 strategy that was unveiled...
Tuesday 13 July 2021
TSMC mulls 28nm, 12/16nm process capacity expansion overseas
TSMC will soon disclose plans to build additional 28nm and 12/16nm process fabrication lines at new fabs, in addition to its Nanjing fab expansion, according to industry sources.
Monday 12 July 2021
Nanya expects DRAM prices to continue rally
DRAM contract prices, which registered a substantial increase in the second quarter of 2021, are expected to continue their rally in the third quarter, according to chipmaker Nanya...
Wednesday 7 July 2021
TSMC under US pressure over expansion at China fab
TSMC is coming under pressure from the US over its plan to expand foundry capacity in China, according to industry sources.
Monday 5 July 2021
GF, PSMC see major business turnaround on robust foundry demand
Persistent foundry capacity crunch has not only ushered in high growth prospects for leading player TSMC, but also enabled some losses-ridden peers such as GlobalFoundries (GF) and...
Monday 28 June 2021
Foundries accelerating 28nm process capacity expansions
Foundries including TSMC and UMC, and China's SMIC, have all stepped up their capacity expansions particularly for 28nm process, according to industry sources.
Tuesday 15 June 2021
PSMC negotiating orders for 2023
Taiwan-based pure-play foundry Powerchip Semiconductor Manufacturing (PSMC) continue to see orders demanding 8- and 12-inch wafer fabrication services pull in, and is in talks with...
Tuesday 15 June 2021
DDI backend services, materials see order visibility throughout 2021
Display driver IC (DDI) backend specialists ChipMos Technologies and Chipbond Technology, and related COF and COG packaging materials vendors including Niching Industrial have seen...
Wednesday 9 June 2021
Tight foundry capacity to persist throughout 2021
Taiwan-based pure-play foundries continue to see customers pull in orders despite concerns about overbooking, and will see their fab capacity stay extremely tight throughout 2021,...
Tuesday 25 May 2021
Pure-play foundries expanding capacity with prepayments from clients
TSMC and other Taiwan-based pure-play foundries intend to carry out their capacity expansion projects cautiously and progressively to avoid the risk of overcapacity.
Thursday 20 May 2021
UMC gains commitments from major clients for long-term demand
Pure-play foundry United Microelectronics (UMC) has received commitments from eight of its customers for capacity demand for a six-year period, according to industry sources.
Wednesday 5 May 2021
Rising ASPs to boost Nanya, Winbond 2Q21 revenues
Memory chip makers Nanya Technology and Winbond Electronics will see their revenues boosted by rising ASPs in the second quarter, according to industry sources.
Thursday 29 April 2021
UMC to expand factory site in southern Taiwan
Pure-play foundry United Microelectronics (UMC) has announced plans to invest a total of NT$100 billion (US$3.58 billion) in the expansion of its 12-inch factory site in southern...
Friday 23 April 2021
TSMC to expand capacity for 28nm process at China fab
TSMC's board of directors has approved a budget of about US$2.89 billion for installation of mature technology capacity, the pure-play foundry announced on April 22.