Specialty DRAM and flash memory maker Winbond Electronics has seen its 12-inch fab run at full capacity starting July, thanks to the arrival of new orders and seasonal factors.

Despite a ramp-up of orders for 7nm chips, TSMC is still seeing orders for other advanced process nodes remain sluggish which has kept its overall 12-inch fab capacity in oversupply,...

Globalfoundries and ON Semiconductor have entered into a definitive agreement for ON Semi to acquire a 300mm fab located in East Fishkill, New York, according to the companies.

Alpha & Omega Semiconductor (AOS), which designs and manufactures power semiconductors for a broad range of applications, will start production at its new 12-inch wafer plant...

Recent rumors circulating in the chipmaking industry have claimed that Globalfoundries is looking to sell another Singapore-based fab, likely a 12-inch one, following the deal it...

Taiwan Semiconductor Manufacturing Company (TSMC) has seen the delivery time for chips produced on its advanced node processes reduced to less than two months compared with over three...

The huge annual trade deficit of up to US$375 billion is definitely a major reason for the US to raise tariffs on goods imported from China, but the trade war seems to be more of...

Foxconn Electronics' (Hon Hai Precision Industry) ambition in the chipmaking sector is taking shape. The Taiwan-based conglomerate reportedly has stuck a deal with China's Zhuhai...

Defying slack demand from smartphone and the impact of the US-China trade war, foundry houses in Taiwan and China are rushing to expand capacities at their 8-inch wafer fabs seeking...

Silicon wafer market growth for 2019 will depend on chipmakers' 12-inch fab expansions and smartphone demand, Digitimes Research believes.

The board of directors of United Microelectronics (UMC) has authorized a capital budget execution of NT$27.406 billion (US$889.4 million) for capacity deployment.

The world's top DRAM suppliers saw their operating margins climb to record highs in the third quarter of 2018, though their ASP increases started slowing down, according to DRAMeXchange...

China-based pure-play foundry Semiconductor Manufacturing International (SMIC) expects to post a revenue decline of 7-9% sequentially in the fourth quarter of 2018, with gross margin...

Taiwan Semiconductor Manufacturing Company (TSMC) held a ceremony on October 31 to mark the opening of its 12-inch wafer plant in Nanjing, China. Company chairman Mark Liu and CFO...

IC packager Siliconware Precision Industries' (SPIL) production subsidiary in Fujian, China will obtain US$22.5 million worth of investment from China's Jinhua Integrated Circuit...

Winbond Electronics will hold a groundbreaking ceremony for its new 12-inch wafer fab in southern Taiwan on October 3, according to the Kaohsiung city government.

Powerchip Technology has disclosed plans to implement a corporate restructuring project under which the company will transfer all its 12-inch fab operations to subsidiary Maxchip...

Eight-inch fab capacity remains tight, whereas there is an excess of 12-inch fab capacity, according to SC Chien, co-president for pure-play foundry United Microelectronics (UMC).

Pure-play foundry Powerchip Technology has disclosed plans to construct two new 12-inch wafer fabs in Taiwan with total investment estimated at NT$278 billion (US$9.05 billion).

IC foundries have seen their 8-inch fabs run at full utilization, but order visibility for their 12-inch fab capacity is becoming unclear, according to industry sources.

Winbond Electronics has completed the sale of NT$10 billion (US$327.2 million) worth of secured corporate bonds in Taiwan, according to the maker of specialty DRAM and flash memory...

A Chinese court has ruled in favor of United Microelectronics (UMC) in a patent infringement lawsuit against Micron Technology, which would ban sales of the allegedly infringing products...

United Microelectronics (UMC), the second-largest Taiwan-based pure-play foundry, disclosed recently plans to list its HeJian-led China operations on the Shanghai Stock Exchange (SSE)...

DRAM and flash memory maker Winbond Electronics will start constructing a new fab in Kaohsiung, southern Taiwan in September followed by equipment move-in slated for 2020.

Gudeng Precision Industrial has enjoyed a ramp-up of front opening unified pod (FOUP) orders from 12-inch IC foundries in China and Taiwan, while shipments of its extreme ultraviolet...